Intel DG41KR Product Specification - Page 7

Regulatory Compliance and Battery Disposal Information, s, Tables - memory support

Page 7 highlights

Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 79 5.1.1 Safety Standards 79 5.1.2 European Union Declaration of Conformity Statement 80 5.1.3 Product Ecology Statements 81 5.1.4 EMC Regulations 85 5.1.5 Product Certification Markings (Board Level 86 5.2 Battery Disposal Information 87 Figures 1. Major Board Components 11 2. Block Diagram 13 3. Memory Channel Configuration and DIMM Configuration 17 4. Back Panel Audio Connector Options 25 5. LAN Connector LED Locations 27 6. Thermal Sensors and Fan Headers 29 7. Location of the Standby Power Indicator LED 36 8. Detailed System Memory Address Map 40 9. Back Panel Connectors 43 10. Component-side Connectors and Headers 44 11. Connection Diagram for Front Panel Header 50 12. Connection Diagram for Front Panel USB Headers 52 13. Location of the Jumper Block 53 14. Board Dimensions 55 15. Localized High Temperature Zones 58 Tables 1. Feature Summary 9 2. Board Components Shown in Figure 1 12 3. Supported Memory Configurations 15 4. HDMI Port Status Conditions 19 5. Audio Jack Retasking Support 24 6. LAN Connector LED States 27 7. Effects of Pressing the Power Switch 30 8. Power States and Targeted System Power 31 9. Wake-up Devices and Events 32 10. System Memory Map 41 11. Component-side Connectors and Headers Shown in Figure 10 45 12. Serial ATA Connectors 46 13. Serial Port Header 46 14. Chassis Intrusion Header 46 15. Front and Rear Chassis (3-pin) Fan Headers 47 16. Processor (4-pin) Fan Header 47 17. Front Panel Audio Header for Intel HD Audio 47 18. Front Panel Audio Header for AC '97 Audio 47 vii

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Contents
vii
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
79
5.1.1
Safety Standards
..................................................................
79
5.1.2
European Union Declaration of Conformity Statement
................
80
5.1.3
Product Ecology Statements
...................................................
81
5.1.4
EMC Regulations
..................................................................
85
5.1.5
Product Certification Markings (Board Level)
.............................
86
5.2
Battery Disposal Information
.............................................................
87
Figures
1.
Major Board Components
..................................................................
11
2.
Block Diagram
................................................................................
13
3.
Memory Channel Configuration and DIMM Configuration
........................
17
4.
Back Panel Audio Connector Options
..................................................
25
5.
LAN Connector LED Locations
............................................................
27
6.
Thermal Sensors and Fan Headers
.....................................................
29
7.
Location of the Standby Power Indicator LED
.......................................
36
8.
Detailed System Memory Address Map
...............................................
40
9.
Back Panel Connectors
.....................................................................
43
10. Component-side Connectors and Headers
...........................................
44
11. Connection Diagram for Front Panel Header
........................................
50
12. Connection Diagram for Front Panel USB Headers
................................
52
13. Location of the Jumper Block
.............................................................
53
14. Board Dimensions
...........................................................................
55
15. Localized High Temperature Zones
.....................................................
58
Tables
1.
Feature Summary
..............................................................................
9
2.
Board Components Shown in Figure 1
................................................
12
3.
Supported Memory Configurations
.....................................................
15
4.
HDMI Port Status Conditions
.............................................................
19
5.
Audio Jack Retasking Support
...........................................................
24
6.
LAN Connector LED States
................................................................
27
7.
Effects of Pressing the Power Switch
..................................................
30
8.
Power States and Targeted System Power
...........................................
31
9.
Wake-up Devices and Events
............................................................
32
10. System Memory Map
.......................................................................
41
11. Component-side Connectors and Headers Shown in Figure 10
................
45
12. Serial ATA Connectors
......................................................................
46
13. Serial Port Header
...........................................................................
46
14. Chassis Intrusion Header
..................................................................
46
15. Front and Rear Chassis (3-pin) Fan Headers
........................................
47
16. Processor (4-pin) Fan Header
............................................................
47
17. Front Panel Audio Header for Intel HD Audio
........................................
47
18. Front Panel Audio Header for AC ’97 Audio
..........................................
47