Intel DH77DF Technical Product Specification - Page 11

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Memory Chipset Graphics Audio Mini ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]) • 3rd generation Intel® Core processor family and 2nd generation Intel® Core processor family processors with up to 95 W TDP in an LGA1155 socket ― One PCI Express* x16 graphics interface ― Integrated memory controller with dual channel DDR3 memory support ― Integrated graphics processing (processors with Intel® HD Graphics) ― External graphics interface controller • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 16 GB of system memory with two DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory • Support for XMP memory Note: DDR3 1600 MHz DIMMs are only supported by 3rd generation Intel Core processor family processors Intel® H77 Express Chipset consisting of the Intel® H77 Express Platform Controller Hub (PCH) • Integrated graphics support for processors with Intel HD Graphics: ― High Definition Multimedia Interface* (HDMI*) v1.4a ― DVI-I v1.0 ― DisplayPort* v1.1a • Support for a PCI Express* 3.0 x16 add-in graphics card Note: PCI Express 3.0 is only supported by 3rd generation Intel Core processor family processors • 8-channel (7.1 + 2) Intel® High Definition (Intel® HD) Audio via the Realtek* ALC898 audio codec including: ― Front panel audio header with support for Intel HD Audio and AC '97 Audio ― Five analog audio jacks on the back panel ― Onboard S/PDIF out header and back panel optical S/PDIF out connector • 8-channel (7.1) Intel HD Audio via the High Definition Multimedia Interface* (HDMI*) continued 11