Intel DH77DF Technical Product Specification - Page 66

Table 40., Thermal Considerations for Components, Table 41., Tcontrol Values for Components - bios update

Get Intel DH77DF PDF manuals and user guides View all Intel DH77DF manuals
Add to My Manuals
Save this manual to your list of manuals

Page 66 highlights

Intel Desktop Board DH77DF Technical Product Specification Table 40 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 40. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H77 Express Chipset 104 oC To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 40. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol. Table 41. Tcontrol Values for Components Component Tcontrol Processor For processor case temperature, see processor datasheets and processor specification updates Intel H77 Express Chipset 104 oC For information about Processor datasheets and specification updates Intel H77 Express Chipset Refer to Section 1.2, page 17 http://www.intel.com/products/desktop/ chipsets/ 66

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
Intel Desktop Board DH77DF Technical Product Specification
66
Table 40 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 40.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H77 Express Chipset
104
o
C
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 40. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.
Table 41.
Tcontrol Values for Components
Component
Tcontrol
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H77 Express Chipset
104
o
C
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 17
Intel H77 Express Chipset
chipsets/