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Intel DQ67EP Product Specification - Page 62

Reliability, Environmental

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Intel Desktop Board DQ67EP Technical Product Specification 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia "Reliability Prediction Procedure for Electronic Equipment" (Reference Model Telcordia SR-332 Issue 2, Reference Method Telcordia (Bellcore) Method I, Case 3). The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 250,048 hours. 2.9 Environmental Table 30 lists the environmental specifications for the board. Table 30. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -40 °C to +60 °C 0 °C to +40 °C 50 g trapezoidal waveform Velocity change of 170 inches/second² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DQ67EP Technical Product Specification	1
Revision History	2
Preface	3
Contents	5
1 Product Description	9
1.1 Overview	9
1.1.1 Feature Summary	9
1.1.2 Board Layout	11
1.1.3 Block Diagram	13
1.2 Legacy Considerations	14
1.3 Online Support	14
1.4 Processor	14
1.5 Intel® Q67 Express Chipset	15
1.6 System Memory	15
1.6.1 Memory Configurations	16
1.7 Graphics Subsystem	18
1.7.1 Integrated Graphics	18
1.7.2 PCI Express x16 Graphics	19
1.8 USB	19
1.9 SATA Interfaces	20
1.10 Legacy I/O Controller	21
1.10.1 Serial Port	21
1.11 Audio Subsystem	22
1.11.1 Audio Subsystem Software	22
1.11.2 Audio Headers and Connectors	22
1.12 LAN Subsystem	24
1.12.1 Intel® 82579LM Gigabit Ethernet Controller	24
1.12.2 LAN Subsystem Software	24
1.12.3 RJ-45 LAN Connector with Integrated LEDs	25
1.13 Real-Time Clock Subsystem	26
1.14 Thermal Monitoring	27
1.15 Platform Management and Security	28
1.15.1 Hardware Management Subsystem	28
1.15.2 Hardware Monitoring	28
1.15.3 Intel® vPro™ Technology	29
1.16 Power Management	33
1.16.1 ACPI	34
1.16.2 Hardware Support	37
2 Technical Reference	41
2.1 Memory Resources	41
2.1.1 Addressable Memory	41
2.1.2 Memory Map	43
2.2 Connectors and Headers	43
2.2.1 Back Panel Connectors	44
2.2.2 Component-side Connectors and Headers	45
2.3 BIOS Configuration Jumper Block	54
2.4 Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header	55
2.5 Mechanical Considerations	57
2.5.1 Form Factor	57
2.6 Electrical Considerations	58
2.6.1 Power Supply Considerations	58
2.6.2 Fan Header Current Capability	59
2.6.3 Add-in Board Considerations	59
2.7 Thermal Considerations	60
2.8 Reliability	62
2.9 Environmental	62
3 Overview of BIOS Features	63
3.1 Introduction	63
3.2 System Management BIOS (SMBIOS)	65
3.3 Legacy USB Support	65
3.4 BIOS Updates	66
3.4.1 Language Support	66
3.4.2 Custom Splash Screen	67
3.5 BIOS Recovery	67
3.6 Boot Options	68
3.6.1 Optical Drive Boot	68
3.6.2 Network Boot	68
3.6.3 Booting Without Attached Devices	68
3.6.4 Changing the Default Boot Device During POST	68
3.7 Hard Disk Drive Password Security Feature	69
3.8 BIOS Security Features	70
4 Error Messages and Beep Codes	73
4.1 Speaker	73
4.2 BIOS Beep Codes	73
4.3 Front-panel Power LED Blink Codes	74
4.4 BIOS Error Messages	74
4.5 Port 80h POST Codes	75
5 Regulatory Compliance and Battery Disposal Information	81
5.1 Regulatory Compliance	81
5.1.1 Safety Standards	81
5.1.2 European Union Declaration of Conformity Statement	82
5.1.3 Product Ecology Statements	83
5.1.4 EMC Regulations	85
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	88
5.1.6 Regulatory Compliance Marks (Board Level)	89