Home » Intel Manuals » Processors » Intel E6420 » Manual Viewer

Intel E6420 Data Sheet - Page 89

PROCHOT# Signal, THERMTRIP# Signal

UPC - 735858192569

Add to My Manuals
Save this manual to your list of manuals

Page 89 highlights

Thermal Specifications and Design Considerations 5.2.4 5.2.5 PROCHOT# Signal An external signal, PROCHOT# (processor hot), is asserted when the processor core temperature has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the Thermal Monitor must be enabled for the processor to be operating within specification), the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#. As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that one or both cores has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC, if enabled, for both cores. The TCC will remain active until the system de-asserts PROCHOT#. PROCHOT# allows for some protection of various components from over-temperature situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor (either core) has reached its maximum operating temperature or be driven from an external source to activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal protection of system components. PROCHOT# can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR, and rely on PROCHOT# only as a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its Thermal Design Power. With a properly designed and characterized thermal solution, it is anticipated that PROCHOT# would only be asserted for very short periods of time when running the most power intensive applications. An under-designed thermal solution that is not able to prevent excessive assertion of PROCHOT# in the anticipated ambient environment may cause a noticeable performance loss. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for details on implementing the bi-directional PROCHOT# feature. THERMTRIP# Signal Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in Table 26). At this point, the FSB signal THERMTRIP# will go active and stay active as described in Table 26. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles. Datasheet 89

Section	Page
Contents	3
Figures	5
Tables	6
Revision History	7
Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequence Features	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Terminology	12
1.2 References	14
Table 1. Reference Documents	14
2 Electrical Specifications	15
2.1 Power and Ground Lands	15
2.2 Decoupling Guidelines	15
2.2.1 VCC Decoupling	15
2.2.2 Vtt Decoupling	15
2.2.3 FSB Decoupling	16
2.3 Voltage Identification	16
Table 2. Voltage Identification Definition	17
2.4 Market Segment Identification (MSID)	18
Table 3. Market Segment Selection Truth Table for MSID[1:0], , ,	18
2.5 Reserved, Unused, and TESTHI Signals	18
2.6 Voltage and Current Specification	19
2.6.1 Absolute Maximum and Minimum Ratings	19
Table 4. Absolute Maximum and Minimum Ratings	20
2.6.2 DC Voltage and Current Specification	20
Table 5. Voltage and Current Specifications	20
Table 6. VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache	22
Figure 1. VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache	23
Table 7. VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache	24
Figure 2. VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache	25
2.6.3 VCC Overshoot	25
Table 8. VCC Overshoot Specifications	25
Figure 3. VCC Overshoot Example Waveform	26
2.6.4 Die Voltage Validation	26
2.7 Signaling Specifications	26
2.7.1 FSB Signal Groups	27
Table 9. FSB Signal Groups	27
Table 10. Signal Characteristics	28
Table 11. Signal Reference Voltages	28
2.7.2 CMOS and Open Drain Signals	28
2.7.3 Processor DC Specifications	29
Table 12. GTL+ Signal Group DC Specifications	29
Table 13. Open Drain and TAP Output Signal Group DC Specifications	29
Table 14. CMOS Signal Group DC Specifications	30
2.7.3.1 GTL+ Front Side Bus Specifications	30
Table 15. GTL+ Bus Voltage Definitions	30
2.7.4 Clock Specifications	31
2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
Table 16. Core Frequency to FSB Multiplier Configuration	31
2.7.6 FSB Frequency Select Signals (BSEL[2:0])	31
Table 17. BSEL[2:0] Frequency Table for BCLK[1:0]	32
2.7.7 Phase Lock Loop (PLL) and Filter	32
2.7.8 BCLK[1:0] Specifications (CK505 based Platforms)	32
Table 18. Front Side Bus Differential BCLK Specifications	32
Figure 4. Differential Clock Waveform	33
Figure 5. Differential Clock Crosspoint Specification	33
Figure 6. Differential Measurements	33
2.7.9 BCLK[1:0] Specifications (CK410 based Platforms)	34
Table 19. Front Side Bus Differential BCLK Specifications	34
Figure 7. Differential Clock Crosspoint Specification	34
2.8 PECI DC Specifications	35
Table 20. PECI DC Electrical Limits	35
3 Package Mechanical Specifications	37
Figure 8. Processor Package Assembly Sketch	37
3.1 Package Mechanical Drawing	37
Figure 9. Processor Package Drawing Sheet 1 of 3	38
Figure 10. Processor Package Drawing Sheet 2 of 3	39
Figure 11. Processor Package Drawing Sheet 3 of 3	40
3.1.1 Processor Component Keep-Out Zones	41
3.1.2 Package Loading Specifications	41
Table 21. Processor Loading Specifications	41
3.1.3 Package Handling Guidelines	41
Table 22. Package Handling Guidelines	41
3.1.4 Package Insertion Specifications	42
3.1.5 Processor Mass Specification	42
3.1.6 Processor Materials	42
Table 23. Processor Materials	42
3.1.7 Processor Markings	42
Figure 12. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache with 1333 MHz FSB	42
Figure 13. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 4 MB L2 Cache with 1066 MHz FSB	43
Figure 14. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 2 MB L2 Cache	43
Figure 15. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E4000 Sequence with 2 MB L2 Cache	44
Figure 16. Processor Top-Side Markings for the Intel® Core™2 Extreme Processor X6800	44
3.1.8 Processor Land Coordinates	45
Figure 17. Processor Land Coordinates and Quadrants (Top View)	45
4 Land Listing and Signal Descriptions	47
4.1 Processor Land Assignments	47
Figure 18. land-out Diagram (Top View - Left Side)	48
Figure 19. land-out Diagram (Top View - Right Side)	49
Table 24. Alphabetical Land Assignments	50
Table 25. Numerical Land Assignment	60
4.2 Alphabetical Signals Reference	70
Table 26. Signal Description (Sheet 1 of 9)	70
5 Thermal Specifications and Design Considerations	79
5.1 Processor Thermal Specifications	79
5.1.1 Thermal Specifications	79
Table 27. Processor Thermal Specifications	80
Table 28. Thermal Profile (Intel® Core™2 Duo Desktop Processor E6x50 Sequence and E6540 with 4 MB L2 Cache)	81
Figure 20. Thermal Profile (Intel® Core™2 Duo Desktop Processor E6x50 Sequence and E6540 with 4 MB L2 Cache)	81
Table 29. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache)	82
Figure 21. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache)	82
Table 30. Thermal Profile (Intel® Core™2 Duo Desktop Processor E4500 and E4600 with 2 MB L2 Cache)	83
Figure 22. Thermal Profile (Intel® Core™2 Duo Desktop Processor E4500 and E4600 with 2 MB L2 Cache)	83
Table 31. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 and E4000 Sequence with 2 MB L2 Cache)	84
Figure 23. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 and E4000 Sequence with 2 MB L2 Cache)	84
Table 32. Thermal Profile (Intel® Core™2 Extreme Processor X6800)	85
Figure 24. Thermal Profile (Intel® Core™2 Extreme Processor X6800)	85
5.1.2 Thermal Metrology	86
Figure 25. Case Temperature (TC) Measurement Location	86
5.2 Processor Thermal Features	86
5.2.1 Thermal Monitor	86
5.2.2 Thermal Monitor 2	87
Figure 26. Thermal Monitor 2 Frequency and Voltage Ordering	88
5.2.3 On-Demand Mode	88
5.2.4 PROCHOT# Signal	89
5.2.5 THERMTRIP# Signal	89
5.3 Thermal Diode	90
Table 33. Thermal “Diode” Parameters using Diode Model	90
Table 34. Thermal “Diode” Parameters using Transistor Model	91
Table 35. Thermal Diode Interface	91
5.4 Platform Environment Control Interface (PECI)	92
5.4.1 Introduction	92
Figure 27. Processor PECI Topology	92
5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management	92
Figure 28. Conceptual Fan Control on PECI-Based Platforms	93
Figure 29. Conceptual Fan Control on Thermal Diode-Based Platforms	93
5.4.2 PECI Specifications	94
5.4.2.1 PECI Device Address	94
5.4.2.2 PECI Command Support	94
5.4.2.3 PECI Fault Handling Requirements	94
5.4.2.4 PECI GetTemp0() Error Code Support	94
Table 36. GetTemp0() Error Codes	94
6 Features	95
6.1 Power-On Configuration Options	95
Table 37. Power-On Configuration Option Signals	95
6.2 Clock Control and Low Power States	95
Figure 30. Processor Low Power State Machine	96
6.2.1 Normal State	96
6.2.2 HALT and Extended HALT Powerdown States	96
6.2.2.1 HALT Powerdown State	96
6.2.2.2 Extended HALT Powerdown State	97
6.2.3 Stop Grant and Extended Stop Grant States	97
6.2.3.1 Stop Grant State	97
6.2.3.2 Extended Stop Grant State	98
6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	98
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	98
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	98
6.3 Enhanced Intel® SpeedStep® Technology	98
7 Boxed Processor Specifications	101
Figure 31. Mechanical Representation of the Boxed Processor	101
7.1 Mechanical Specifications	102
7.1.1 Boxed Processor Cooling Solution Dimensions	102
Figure 32. Space Requirements for the Boxed Processor (Side View)	102
Figure 33. Space Requirements for the Boxed Processor (Top View)	102
Figure 34. Space Requirements for the Boxed Processor (Overall View)	103
7.1.2 Boxed Processor Fan Heatsink Weight	103
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	103
7.2 Electrical Requirements	103
7.2.1 Fan Heatsink Power Supply	103
Figure 35. Boxed Processor Fan Heatsink Power Cable Connector Description	104
Table 38. Fan Heatsink Power and Signal Specifications	104
Figure 36. Baseboard Power Header Placement Relative to Processor Socket	105
7.3 Thermal Specifications	105
7.3.1 Boxed Processor Cooling Requirements	105
Figure 37. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)	106
Figure 38. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)	106
7.3.2 Fan Speed Control Operation (Intel® Core2 Extreme Processor X6800 Only)	107
7.3.3 Fan Speed Control Operation (Intel® Core2 Duo Desktop Processor E6000 and E4000 Sequences Only)	107
Figure 39. Boxed Processor Fan Heatsink Set Points	108
Table 39. Fan Heatsink Power and Signal Specifications	108
8 Balanced Technology Extended (BTX) Boxed Processor Specifications	111
Figure 40. Mechanical Representation of the Boxed Processor with a Type I TMA	111
Figure 41. Mechanical Representation of the Boxed Processor with a Type II TMA	112
8.1 Mechanical Specifications	112
8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions	112
Figure 42. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes	113
Figure 43. Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume	114
8.1.2 Boxed Processor Thermal Module Assembly Weight	114
8.1.3 Boxed Processor Support and Retention Module (SRM)	115
Figure 44. Assembly Stack Including the Support and Retention Module	115
8.2 Electrical Requirements	116
8.2.1 Thermal Module Assembly Power Supply	116
Figure 45. Boxed Processor TMA Power Cable Connector Description	116
Table 40. TMA Power and Signal Specifications	117
Figure 46. Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area)	117
8.3 Thermal Specifications	118
8.3.1 Boxed Processor Cooling Requirements	118
8.3.2 Variable Speed Fan	118
Figure 47. Boxed Processor TMA Set Points	119
Table 41. TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors	119
9 Debug Tools Specifications	121
9.1 Logic Analyzer Interface (LAI)	121
9.1.1 Mechanical Considerations	121

Match case Limit results 1 per page

Datasheet

Thermal Specifications and Design Considerations

5.2.4

PROCHOT# Signal

An external signal, PROCHOT# (processor hot), is asserted when the processor core

temperature has reached its maximum operating temperature. If the Thermal Monitor

is enabled (note that the Thermal Monitor must be enabled for the processor to be

operating within specification), the TCC will be active when PROCHOT# is asserted. The

processor can be configured to generate an interrupt upon the assertion or de-

assertion of PROCHOT#.

As an output, PROCHOT# (Processor Hot) will go active when the processor

temperature monitoring sensor detects that one or both cores has reached its

maximum safe operating temperature. This indicates that the processor Thermal

Control Circuit (TCC) has been activated, if enabled. As an input, assertion of

PROCHOT# by the system will activate the TCC, if enabled, for both cores. The TCC will

remain active until the system de-asserts PROCHOT#.

PROCHOT# allows for some protection of various components from over-temperature

situations. The PROCHOT# signal is bi-directional in that it can either signal when the

processor (either core) has reached its maximum operating temperature or be driven

from an external source to activate the TCC. The ability to activate the TCC via

PROCHOT# can provide a means for thermal protection of system components.

PROCHOT# can allow VR thermal designs to target maximum sustained current instead

of maximum current. Systems should still provide proper cooling for the VR, and rely

on PROCHOT# only as a backup in case of system cooling failure. The system thermal

design should allow the power delivery circuitry to operate within its temperature

specification even while the processor is operating at its Thermal Design Power. With a

properly designed and characterized thermal solution, it is anticipated that PROCHOT#

would only be asserted for very short periods of time when running the most power

intensive applications. An under-designed thermal solution that is not able to prevent

excessive assertion of PROCHOT# in the anticipated ambient environment may cause a

noticeable performance loss. Refer to the

Voltage Regulator-Down (VRD) 11.0

Processor Power Delivery Design Guidelines For Desktop LGA775 Socket

for details on

implementing the bi-directional PROCHOT# feature.

5.2.5

THERMTRIP# Signal

Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the

event of a catastrophic cooling failure, the processor will automatically shut down when

the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in

Table 26

). At this point, the FSB signal THERMTRIP# will go active and stay active as

described in

Table 26

. THERMTRIP# activation is independent of processor activity and

does not generate any bus cycles.