Intel RS25DB080 Hardware User Guide - Page 37

Thermal and Atmospheric Characteristics, Safety Characteristics, Operating Certifications - processors

Page 37 highlights

• State 3. While sitting idle at the DOS prompt. - Supply voltage = 12V +/- 8% (from PCI edge connector only) - Supply voltage = 3.3V +/- 9% (from PCI edge connector only) - Actual power consumption. Table 11. Actual Power Consumption Table PCI Edge connector 3.3V supply +12V supply 3.3V AUX. supply (BBU Applications only) State1 0.96A 0.81A 0.38A State 2 0.86A 0.55A 0.2A State 3 0.92A 0.56A 0.02A Note: +12V is used in the charging circuitry for the battery pack on the optional BBU Remote card. If the BBU remote card is cable connected the following power consumption figures apply: 1. During trickle charging of the battery pack: N/A (no trickle charge for Li-ION 2. During fast charging of the battery pack: 250mA rise in +12V current Thermal and Atmospheric Characteristics The maximum board temperature is limited by the LSI SAS2208 ROC Processor since it uses the most power and will be the hottest component on the board. • SAS2208 maximum junction temperature: 115oC • Ambient temperature: maximum 60oC (without optional BBU) • Maximum 45oC (with optional BBU) • Airflow over SAS2208: 200 ft/min • Environmental humidity: 20% to 80% non-condensing • MTBF: greater than 300,000 hours Safety Characteristics The bare PC board shall meet or exceed the requirements of UL flammability rating V0. The bare PC board shall also be marked with the supplier's name or trademark, type, and UL flammability rating. The maximum electrical potential on the board will be 12.96V potential difference, referenced from ground to +12V. Operating Certifications The RAID controller in this document is qualified to get Microsoft Windows* Winqual certification (WHQL) at product launch. Intel® RAID Controller RS25DB080 Hardware User's Guide 27

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Intel® RAID Controller RS25DB080 Hardware User’s Guide
27
State 3. While sitting idle at the DOS prompt.
Supply voltage = 12V +/- 8% (from PCI edge connector only)
Supply voltage = 3.3V +/- 9% (from PCI edge connector only)
Actual power consumption.
Table 11. Actual Power Consumption Table
Note:
+12V is used in the charging circuitry for the battery pack on the optional BBU Remote
card. If the BBU remote card is cable connected the following power consumption
figures apply:
1. During trickle charging of the battery pack: N/A (no trickle charge for Li-ION
2. During fast charging of the battery pack: 250mA rise in +12V current
Thermal and Atmospheric Characteristics
The maximum board temperature is limited by the LSI SAS2208 ROC Processor since it
uses the most power and will be the hottest component on the board.
SAS2208 maximum junction temperature: 115
o
C
Ambient temperature: maximum 60
o
C (without optional BBU)
Maximum 45
o
C (with optional BBU)
Airflow over SAS2208: 200 ft/min
Environmental humidity: 20% to 80% non-condensing
MTBF: greater than 300,000 hours
Safety Characteristics
The bare PC board shall meet or exceed the requirements of UL flammability rating V0.
The bare PC board shall also be marked with the supplier's name or trademark, type, and
UL flammability rating. The maximum electrical potential on the board will be 12.96V
potential difference, referenced from ground to +12V.
Operating Certifications
The RAID controller in this document is qualified to get Microsoft Windows* Winqual
certification (WHQL) at product launch.
PCI Edge connector
State1
State 2
State 3
3.3V supply
0.96A
0.86A
0.92A
+12V supply
0.81A
0.55A
0.56A
3.3V AUX. supply (BBU Applications only)
0.38A
0.2A
0.02A