Samsung SRP-350PG Service Manual - Page 111

USB I/F PCB - usc

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11-5 USB I/F PCB 11-5-1 Component and Solder Side 11 PCB Layout and Parts List 11-5-2 Parts List CODE NO JE75-00018D 0401-001003 0904-001319 2007-000028 2007-000241 2007-000290 2007-000300 2007-000308 2007-000468 2007-000477 2007-000551 2007-000671 2203-000192 2203-000239 2203-000239 2203-000361 2203-000634 2203-000634 2203-000683 2203-000938 2402-000168 2404-000128 2404-000468 2703-000214 2801-003699 3301-000317 3301-000317 3301-001117 3702-001125 3722-001101 4701-001020 JE41-00467E JE70-00290P 6003-000261 DESCRIPTION / SPECIFICATION PBA SUB-USB DIODE-SWITCHING MMBD6050LT1,70V,200mA,225mW,4n IC-USC USBN9602-28M,8BIT,SOP,28P,300MIL,48MHZ,3.3V R-CHIP 39OHM,5%,1/10W,DA,TP,2012 R-CHIP 1.5KOHM,5%,1/10W,DA,TP,2012 R-CHIP 100OHM,5%,1/10W,DA,TP,2012 R-CHIP 10KOHM,5%,1/10W,DA,TP,2012 R-CHIP 10OHM,5%,1/10W,DA,TP,2012 R-CHIP 1KOHM,5%,1/10W,DA,TP,2012 R-CHIP 1MOHM,5%,1/10W,DA,TP,2012 R-CHIP 20OHM,5%,1/10W,DA,TP,2012 R-CHIP 2KOHM,5%,1/10W,DA,TP,2012 C-CERAMIC,CHIP 100nF,+80-20%,50V,Y5V,TP,2012 C-CERAMIC,CHIP 0.1nF,5%,50V,NP0,TP,2012 C-CERAMIC,CHIP 0.1nF,5%,50V,NP0,TP,2012 C-CERAMIC,CHIP 0.15nF,5%,50V,NP0,TP,2012 C-CERAMIC,CHIP 0.022nF,5%,50V,NP0,TP,2012 C-CERAMIC,CHIP 0.022nF,5%,50V,NP0,TP,2012 C-CERAMIC,CHIP 0.027nF,5%,50V,NP0,TP,2012 C-CERAMIC,CHIP 0.47nF,5%,50V,NP0,TP,2012 C-AL,SMD 100uF,20%,16V,GP,TP,8.3x8.3x6.3mm C-TA,CHIP 10uF,20%,16V,-,TP,6032 C-TA,CHIP 33uF,20%,16V,GP,TP,7343 INDUCTOR-SMD 470nH,10%,1.25x2x1.25mm CRYSTAL-UNIT48MHz,50ppm,28-ABM,12pF,80ohm CORE-FERRITE BEAD AB,2x1.25x0.9mm,CIM21J121NES CORE-FERRITE BEAD AB,2x1.25x0.9mm,CIM21J121NES CORE-FERRITE BEAD AB,125ohm,1500mA,TR,0.05ohm CONNECTOR-RIBBON 34P,FEMALE,ANGLE,AUF JACK-USB 4P/1C B,8.38MM,AU,IVR,#22-28 IC-FREQ-ATTENUATOR 5-80MHz,15dB,-,0.03W PCB-USB,FR-4,2L,T1.6 IPR-BRKT USB,SECC,1.0 SCREW M3X6,TAPTITE Q'TY REMARK 1 2 D3 D4 1 U2 1 R21 1 R20 1 R26 1 R23 1 R25 2 R27 R28 1 R22 2 R18 R19 1 R24 9 C12 C13 C14 C15 C16 C17 C18 C19 C36 8 C4 C5 C6 C7 C8 C9 C10 C11 3 C29 C31 C34 1 C27 3 C30 C32 C33 3 C20 C21 C22 2 C23 C24 1 C25 1 C35 2 C2 C3 1 C1 1 L11 1 OSC1 6 L2 L3 L4 L5 L6 L7 3 L8 L9 L10 2 L12 L13 1 CN1 1 CN2 1 U1 1 1 2 Serviceable Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N Y Y Samsung Electro-Mechanics 11-15

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1
1
PCB Layout and Parts List
1
1
-1
5
1
1
-5 USB I/F PCB
1
1
-5-1 Component and Solder Side
1
1
-5-2 Parts List
Samsung Electro-M
e
chanics
CODE NO
DESCRIPTION / SPECIFICATION
Q'TY
REMARK
Serviceable
JE75-00018D
PBA SUB-USB
1
Y
0401-001003
DIODE-SWITCHING MMBD6050LT1,70V,200mA,225mW,4n
2
D3 D4
Y
0904-001319
IC-USC USBN9602-28M,8BIT,SOP,28P,300MIL,48MHZ,3.3V
1
U2
Y
2007-000028
R-CHIP 39OHM,5%,1/10W,DA,TP,2012
1
R21
Y
2007-000241
R-CHIP 1.5KOHM,5%,1/10W,DA,TP,2012
1
R20
Y
2007-000290
R-CHIP 100OHM,5%,1/10W,DA,TP,2012
1
R26
Y
2007-000300
R-CHIP 10KOHM,5%,1/10W,DA,TP,2012
1
R23
Y
2007-000308
R-CHIP 10OHM,5%,1/10W,DA,TP,2012
1
R25
Y
2007-000468
R-CHIP 1KOHM,5%,1/10W,DA,TP,2012
2
R27 R28
Y
2007-000477
R-CHIP 1MOHM,5%,1/10W,DA,TP,2012
1
R22
Y
2007-000551
R-CHIP 20OHM,5%,1/10W,DA,TP,2012
2
R18 R19
Y
2007-000671
R-CHIP 2KOHM,5%,1/10W,DA,TP,2012
1
R24
Y
2203-000192
C-CERAMIC,CHIP 100nF,+80-20%,50V,Y5V,TP,2012
9
C12
C13
C14
C15
C16
C17
C18
C19
C36
Y
2203-000239
C-CERAMIC,CHIP 0.1nF,5%,50V,NP0,TP,2012
8
C4 C5 C6 C7 C8 C9 C10 C11
Y
2203-000239
C-CERAMIC,CHIP 0.1nF,5%,50V,NP0,TP,2012
3
C29 C31 C34
Y
2203-000361
C-CERAMIC,CHIP 0.15nF,5%,50V,NP0,TP,2012
1
C27
Y
2203-000634
C-CERAMIC,CHIP 0.022nF,5%,50V,NP0,TP,2012
3
C30 C32 C33
Y
2203-000634
C-CERAMIC,CHIP 0.022nF,5%,50V,NP0,TP,2012
3
C20 C21 C22
Y
2203-000683
C-CERAMIC,CHIP 0.027nF,5%,50V,NP0,TP,2012
2
C23 C24
Y
2203-000938
C-CERAMIC,CHIP 0.47nF,5%,50V,NP0,TP,2012
1
C25
Y
2402-000168
C-AL,SMD 100uF,20%,16V,GP,TP,8.3x8.3x6.3mm
1
C35
Y
2404-000128
C-TA,CHIP 10uF,20%,16V,-,TP,6032
2
C2 C3
Y
2404-000468
C-TA,CHIP 33uF,20%,16V,GP,TP,7343
1
C1
Y
2703-000214
INDUCTOR-SMD 470nH,10%,1.25x2x1.25mm
1
L11
Y
2801-003699
CRYSTAL-UNIT48MHz,50ppm,28-ABM,12pF,80ohm
1
OSC1
Y
3301-000317
CORE-FERRITE BEAD AB,2x1.25x0.9mm,CIM21J121NES
6
L2 L3 L4 L5 L6 L7
Y
3301-000317
CORE-FERRITE BEAD AB,2x1.25x0.9mm,CIM21J121NES
3
L8 L9 L10
Y
3301-001117
CORE-FERRITE BEAD AB,125ohm,1500mA,TR,0.05ohm
2
L12 L13
Y
3702-001125
CONNECTOR-RIBBON 34P,FEMALE,ANGLE,AUF
1
CN1
Y
3722-001101
JACK-USB 4P/1C B,8.38MM,AU,IVR,#22-28
1
CN2
Y
4701-001020
IC-FREQ-ATTENUATOR 5-80MHz,15dB,-,0.03W
1
U1
Y
JE41-00467E
PCB-USB,FR-4,2L,T1.6
1
N
JE70-00290P
IPR-BRKT USB,SECC,1.0
1
Y
6003-000261
SCREW M3X6,TAPTITE
2
Y