Seagate ST800FM0012 Pulsar Serial ATA Product Manual - Page 28

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Pulsar Product Manual, Rev. A

3.5

Cooling

Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding

the drive will not exceed temperature conditions specified in Section 2.9.1, "Ambient temperature."

The rack, cabinet, or drawer environment for the drive must provide heat removal. You should confirm that ade-

quate heat removal is provided using the temperature measurement guidelines described in Section 2.9.1.

Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 2.9.1

in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is

created while providing air flow to the drive. Also, the shortest possible path between the air inlet and exit

should be chosen to minimize the travel length of air heated by the drive and other heat sources within the

rack, cabinet, or drawer environment.

If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 4. The air-flow pat-

terns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction,

convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guide-

lines of Section 2.9.1 are met.

Figure 4. Air flow

Above unit

Under unit

Note.

Air flows in the direction shown (back to front)

or in reverse direction (front to back)

Above unit

Under unit

Note.

Air flows in the direction shown or

in reverse direction (side to side)

Section	Page
1.0 Introduction	7
1.1 About the Serial ATA interface	8
2.0 Drive specifications	9
2.1 Specification summary tables	9
2.2 Formatted capacity	11
2.2.1 LBA mode	11
2.3 Default logical geometry for ATA based systems	11
2.4 Performance, Recording and interface technology	11
2.4.1 Interface technology	11
2.4.2 Recording technology	11
2.4.3 Performance	12
2.5 Physical characteristics	12
2.6 Access time	13
2.7 Time to Ready	13
2.8 Power specifications	14
2.8.1 Power consumption	14
2.8.1.1 Typical current profiles	18
2.8.2 Conducted noise	18
2.8.3 Voltage tolerance	18
2.9 Environmental specifications	19
2.9.1 Ambient temperature	19
2.9.2 Temperature gradient	19
2.9.3 Humidity	19
2.9.3.1 Relative humidity	19
2.9.3.2 Wet bulb temperature	19
2.9.4 Altitude	19
2.9.5 Shock	19
2.9.5.1 Operating shock	19
2.9.5.2 Nonoperating shock	19
2.9.6 Vibration	20
2.9.6.1 Operating vibration	20
2.9.6.2 Nonoperating vibration	20
2.10 Electromagnetic immunity	20
2.11 Reliability	21
2.11.1 Annualized Failure Rate (AFR) and Mean Time Between Failures (MTBF)	21
2.11.2 Reliability specifications	21
2.12 Agency certification	22
2.12.1 Safety certification	22
2.12.2 Electromagnetic compatibility	22
2.12.3 FCC verification	22
2.13 Environmental protection	23
2.13.1 European Union Restriction of Hazardous Substances (RoHS) Directive	23
2.13.2 China Restriction of Hazardous Substances (RoHS) Directive	23
2.14 Corrosive environment	24
3.0 Configuring and mounting the drive	25
3.1 Handling and static-discharge precautions	25
3.2 Configuring the drive	26
3.3 Serial ATA cables and connectors	26
3.4 Drive mounting	27
3.5 Cooling	28
4.0 Serial ATA (SATA) interface	29
4.1 Hot-Plug compatibility	29
4.2 Serial ATA device plug connector pin definitions	30
4.3 Supported ATA commands	31
4.3.1 Identify Device command	33
4.3.2 Set Features command	40
4.3.3 S.M.A.R.T. commands	41
5.0 Seagate Technology support services	43
Index	45
A	45
C	45
D	45
E	45
F	45
G	45
H	45
I	45
K	45
L	46
M	46
N	46
O	46
P	46
Q	46
R	46
S	46
T	47
U	47
V	47

Seagate ST800FM0012 Pulsar Serial ATA Product Manual - Page 28

Cooling

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