Sharp LC-26SB14U Service Manual - Page 11

DISASSEMBLY INSTRUCTIONS 2. REMOVAL AND INSTALLATION OF FLAT PACKAGE IC REMOVAL 1. Put Masking Tape (cotton tape) around the Flat Package IC to protect other parts from any damage. (Refer to Fig. 2-1.) NOTE Masking is carried out on all the parts located within 10 mm distance from IC leads. 3. When IC starts moving back and forth easily after desoldering completely, pickup the corner of the IC using tweezers and remove the IC by moving with the IC desoldering machine. (Refer to Fig. 2-3.) NOTE Some ICs on the PCB are affixed with glue, so be careful not to break or damage the foil of each IC leads or solder lands under the IC when removing it. Blower type IC desoldering machine Masking Tape IC (Cotton Tape) Tweezers Fig. 2-1 2. Heat the IC leads using a blower type IC desoldering machine. (Refer to Fig. 2-2.) NOTE Do not rotate or move the IC back and forth until IC can move back and forth easily after desoldering the leads completely. Blower type IC desoldering machine IC Fig. 2-3 4. Peel off the Masking Tape. 5. Absorb the solder left on the pattern using the Braided Shield Wire. (Refer to Fig. 2-4.) NOTE Do not move the Braided Shield Wire in the vertical direction towards the IC pattern. Braided Shield Wire Soldering Iron IC Fig. 2-2 IC pattern Fig. 2-4 B2-1