ASRock B75M-DGS R2.0 User Guide - Page 5
English, Speci, cations - micro atx lga1155
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1.2 Specifications Platform CPU Chipset Memory Expansion Slot Graphics - Micro ATX Form Factor - All Solid Capacitor design - Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in LGA1155 Package - Supports Intel® Turbo Boost 2.0 Technology - Supports Hyper-Threading Technology - Intel® B75 - Supports Intel® Small Business Advantage (see CAUTION 1) - Supports Intel® Rapid Start Technology and Smart Connect Technology - Dual Channel DDR3 Memory Technology - 2 x DDR3 DIMM slots - Supports DDR3 1600/1333/1066 non-ECC, un-buffered memory (DDR3 1600 with Intel® Ivy Bridge CPU, DDR3 1333 with Intel® Sandy Bridge CPU) - Max. capacity of system memory: 16GB (see CAUTION 2) - Supports Intel® Extreme Memory Profile (XMP)1.3/1.2 - 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode) (see CAUTION 3) * PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With Intel® Sandy Bridge CPU, it only supports PCIE 2.0. - 1 x PCI slot * Intel® HD Graphics Built-in Visuals and the VGA outputs can be supported only with processors which are GPU integrated. - Supports Intel® HD Graphics Built-in Visuals: Intel® Quick Sync Video 2.0, Intel® InTruTM 3D, Intel® Clear Video HD Technology, Intel® InsiderTM, Intel® HD Graphics 2500/4000 with Intel® Ivy Bridge CPU - Supports Intel® HD Graphics Built-in Visuals: Intel® Quick Sync Video, Intel® InTruTM 3D, Intel® Clear Video HD Technology, Intel® HD Graphics 2000/3000, Intel® Advanced Vector Extensions (AVX) with Intel® Sandy Bridge CPU - Pixel Shader 5.0, DirectX 11 with Intel® Ivy Bridge CPU. Pixel Shader 4.1, DirectX 10.1 with Intel® Sandy Bridge CPU. - Max. shared memory 1760MB with Intel® Ivy Bridge CPU. Max. shared memory 1759MB with Intel® Sandy Bridge CPU. 5 ASRock B75M-DGS R2.0 Motherboard English