ASRock H55M/USB3 R2.0 User Manual - Page 6

1.2 Specifications Platform CPU Chipset Memory Expansion Slot Graphics * - Micro ATX Form Factor: 9.6-in x 8.8-in, 24.4 cm x 22.4 cm - All Solid Capacitor design (100% Japan-made high-quality Conductive Polymer Capacitors) - Supports Intel® CoreTM i7 / i5 / i3 and Pentium® G6950 Processors in LGA1156 Package - 4 + 1 Power Phase Design - Supports Intel® Turbo Boost Technology (see CAUTION 1) - Supports Hyper-Threading Technology (see CAUTION 2) - Supports Untied Overclocking Technology (see CAUTION 3) - Supports EM64T CPU - Intel® H55 - Dual Channel DDR3 Memory Technology (see CAUTION 4) - 2 x DDR3 DIMM slots - Supports DDR3 2600+(OC)/2133(OC)/1866(OC)/1600/ 1333/1066 non-ECC, un-buffered memory - Max. capacity of system memory: 8GB (see CAUTION 5) - Supports Intel® Extreme Memory Profile (XMP) (see CAUTION 6) - 1 x PCI Express 2.0 x16 slot (at x16 mode) - 2 x PCI Express 2.0 x1 slots (2.5GT/s) - 1 x PCI slot * Requires a Processor with Intel® Graphics Technology - Intel® HD Graphics - Pixel Shader 4.0, DirectX 10 - Max. shared memory 1759MB (see CAUTION 7) - Three VGA Output options: D-Sub, DVI-D and HDMI (see CAUTION 8) - Supports HDMI 1.3a Technology with max. resolution up to 1920x1200 - Supports DVI with max. resolution up to 1920x1200 @ 60Hz - Supports D-Sub with max. resolution up to 2048x1536 @ 75Hz - Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and HBR (High Bit Rate Audio) with HDMI 1.3a (Compliant HDMI monitor is required) (see CAUTION 9) - Supports HDCP function with DVI and HDMI ports - Supports Full HD 1080p Blu-ray (BD) / HD-DVD playback with DVI and HDMI ports 6