ASRock Z77 Extreme11 Quick Installation Guide - Page 7
Specifications - intel lga1155
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1.2 Specifications Platform CPU Chipset Memory Expansion Slot - EATX Form Factor: 12.0-in x 10.5-in, 30.5 cm x 26.7 cm - 2oz copper PCB - Premium Gold Capacitor design (100% Japan-made high-quality Conductive Polymer Capacitors) - Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in LGA1155 Package - Digi Power Design - 8 + 4 Power Phase Design - Dual-Stack MOSFET (DSM) - Supports Intel® Turbo Boost 2.0 Technology - Supports Intel® K-Series unlocked CPU - Supports Hyper-Threading Technology - Intel® Z77 - Supports Intel® Rapid Start Technology and Smart Connect Technology - Dual Channel DDR3 Memory Technology - 4 x DDR3 DIMM slots - Supports DDR3 3000+(OC)/2400(OC)/2133(OC)/ 1866(OC)/1600/1333/1066 non-ECC, un-buffered memory - Max. capacity of system memory: 32GB (see CAUTION 1) - Supports Intel® Extreme Memory Profile (XMP)1.3/1.2 - 3 x PCI Express 3.0 x16 slots (PCIE1/PCIE5: single at x16 (PCIE1)/x8(PCIE5) or dual at x8/x8; PCIE3: x8 mode) * PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With Intel® Sandy Bridge CPU, it only supports PCIE 2.0. - 1 x PCI Express 2.0 x16 slot (PCIE7: x4 mode) - 3 x PCI Express 2.0 x1 slots - 1 x mini-PCI Express slot: For WiFi + BT module - PLX PEX 8747 and PLX PEX 8608 embedded - Supports AMD Quad CrossFireXTM, 4-Way 7 ASRock Z77 Extreme11 Motherboard English