Acer LX.EDV0Z.001 Service Guide - Page 26

Hardware Specifications and Configurations Processor Item CPU Manufacturer CPU package Core Logic Chipset Features Specification Intel Micro-FCPGA packaging, 479-pin • NB Chipset Intel CS GM45NB / PM45NB • SB Chipset Intel CS ICH9M • ENE KB926 for Keyboard Controller, Battery management Unit, and RTC. • Integrated VGA solution for Intel 945GSE. • Realtek ALC272X-GR for High Definition Audio Codec. • Atheros AR8114A for 10/100 LAN • Dual-core processor for mobile with enhanced performance • Supports Intel® architecture with Intel® Wide Dynamic Execution • Supports L1 cache-to-cache (C2C) transfer • On-die, primary 32-kB instruction cache and 32-kB write-back data cache in each core • The Penryn processor in XE, SV and LV have an On-die, up to 6-MB second-level shared cache with Advanced Transfer Cache architecture • The Penryn processor in ULV have an On-die, up to 3-MB second-level shared cache with Advanced Transfer Cache architecture • Streaming SIMD extensions 2 (SSE2), streaming SIMD extensions 3 (SSE3), supplemental streaming SIMD extensions 3 (SSSE3) and SSE4.1 instruction sets • The Penryn processor in XE, SV and LV are offered at 667MHz, 800-MHz and 1066-MHz source-synchronous front side bus (FSB) • The Penryn processor in ULV are offered at 667-MHz and 800MHz source synchronous front side bus (FSB) • Advanced power management features including Enhanced Intel SpeedStep® Technology and dynamic FSB frequency switching • Digital thermal sensor (DTS) • Intel® 64 architecture • Supports enhanced Intel® Virtualization Technology • Intel® Dynamic Acceleration Technology and Enhanced Multi Threaded Processor Specifications Item CPU Speed Cores Bus Speed (MHz) Mfg. Tech Cache Size Package P/N P7450 2.13 GHz 2 1066 45 nm 3 MB Micro-FCPGA P8600 2.4 GHz 2 1066 45 nm 3 MB Micro-FCPGA P8700 2.53 GHz 2 1066 45 nm 3 MB Micro-FCPGA P9500 2.53 GHz 2 1066 45 nm 6 MB Micro-FCPGA T6400 2.0 GHz 2 800 45 nm 3 MB Micro-FCPGA 16 Chapter 1