Asus P65UP5-P6ND User Manual - Page 16

System Memory DRAM/SDRAM & SRAM

Page 16 highlights

III. INSTALLATION (Memory) III. INSTALLATION 2. System Memory (DRAM/SDRAM & SRAM) This baseboard supports eight 72-pin SIMMs (Single Inline Memory Modules) of 4MB, 8MB, 16MB, 32MB, 64MB to form a memory size between 8MB to 512MB. The DRAM can be either 60ns or 70ns Fast Page Mode (Asymmetric or Symmetric), Extended Data Output (EDO), or Burst Extended Data Output (BEDO) (with C-P6ND only). SIMMs must be installed in pairs so that each bank contains two of the same size memory modules. To support ECC, you must use true (opposed to phantom parity generated by TTL chips) 36-bit parity-type SIMM (e.g. 8 chips + 4 parity chips) in pairs for all modules. Mixing 32-bit non-parity SIMM (e.g. 8 chips) and 36-bit SIMM (e.g. 12 chips) will work minus the ECC feature. IMPORTANT: Memory setup is required in "Auto Configuration" in the CHIPSET FEATURES SETUP of Section IV BIOS software. Each bank must have the same size memory installed in pairs. Install memory in any or all of the banks in any combination as follows: Bank Bank 0 SIMM Slots 1&2 Memory Module 4MB, 8MB, 16MB, 32MB, 64MB 72-pin FPM, EDO, BEDO SIMM Total Memory x2 Bank 1 4MB, 8MB, 16MB, 32MB, 64MB x2 SIMM Slots 3&4 72-pin FPM, EDO, BEDO SIMM Bank 2 4MB, 8MB, 16MB, 32MB, 64MB x2 SIMM Slots 5&6 72-pin FPM, EDO, BEDO SIMM Bank 3 4MB, 8MB, 16MB, 32MB, 64MB x2 SIMM Slots 7&8 72-pin FPM, EDO, BEDO SIMM Total System Memory = NOTE: Memory on socket 1 has a clearance of 5.0 cm when the C-PKND and C-P6ND CPU cards are installed and 5.5 cm when the C-P55T2D CPU card is installed. NOTE: SIMM numbers are not in sequence, (2, 4, 6, 8, 1, 3, 5, 7 from left to right.) IMPORTANT: Each bank must have the same size memory installed in pairs. Do not use memory modules with more than 24 chips per module. Modules with more than 24 chips exceed the design specifications of the memory subsystem and will be unstable. 16 ASUS P/I-P65UP5 User's Manual

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32

16
ASUS P/I-P65UP5 User’s Manual
III. INSTALLATION
2.
System Memory (DRAM/SDRAM & SRAM)
This baseboard supports eight 72-pin SIMMs (Single Inline Memory Modules) of
4MB, 8MB, 16MB, 32MB, 64MB to form a memory size between 8MB to 512MB.
The DRAM can be either 60ns or 70ns Fast Page Mode (Asymmetric or Symmet-
ric), Extended Data Output (EDO), or Burst Extended Data Output (BEDO) (with
C-P6ND only).
SIMMs must be installed in pairs so that each bank contains two of
the same size memory modules.
To support ECC, you must use
true
(opposed to
phantom parity generated by TTL chips) 36-bit parity-type SIMM (e.g. 8 chips + 4
parity chips) in pairs for all modules.
Mixing 32-bit non-parity SIMM (e.g. 8 chips)
and 36-bit SIMM (e.g. 12 chips) will work minus the ECC feature.
IMPORTANT:
Memory setup is required in “Auto Configuration”
in the
CHIPSET FEATURES SETUP of Section IV BIOS software.
Each bank must
have the same size memory installed in pairs.
Install memory in any or all of the banks in any combination as follows:
Bank
Memory Module
Total Memory
Bank 0
4MB, 8MB, 16MB, 32MB, 64MB
x2
SIMM Slots 1&2
72-pin FPM, EDO, BEDO SIMM
Bank 1
4MB, 8MB, 16MB, 32MB, 64MB
x2
SIMM Slots 3&4
72-pin FPM, EDO, BEDO SIMM
Bank 2
4MB, 8MB, 16MB, 32MB, 64MB
x2
SIMM Slots 5&6
72-pin FPM, EDO, BEDO SIMM
Bank 3
4MB, 8MB, 16MB, 32MB, 64MB
x2
SIMM Slots 7&8
72-pin FPM, EDO, BEDO SIMM
Total System Memory
=
NOTE:
Memory on socket 1 has a clearance of 5.0 cm when the C-PKND and
C-P6ND CPU cards are installed and 5.5 cm when the C-P55T2D CPU card is installed.
NOTE:
SIMM numbers are not in sequence, (2, 4, 6, 8, 1, 3, 5, 7 from left to right.)
IMPORTANT:
Each bank must have the same size memory installed in pairs.
Do
not use memory modules with more than 24 chips per module.
Modules with more
than 24 chips exceed the design specifications of the memory subsystem and will be
unstable.
III.
INSTALLATION
(Memory)