Dell PowerEdge M710HD Technical Guide - Page 18

Thermal

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Dell Stress 8.2 No prominent tones 5.5 Thermal The M710HD thermal solution includes:  Optimized airflow impedance for individual blade and chassis level airflow balancing  Custom air baffling to direct air flow through the components to maintain proper cooling  Custom-designed heat sinks that maintain processor, DIMM, and board-level chip temperatures within thermal design targets  Highly optimized fan control algorithm: o Base fan speeds are a function of hardware configuration and ambient temperature to minimize airflow for a given environment. o PID control algorithms are used for both processor, DIMMs, and NDC to maintain appropriate thermal margin PowerEdge M710HD Technical Guide 18

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Dell
PowerEdge M710HD Technical Guide
18
Stress
8.2
No prominent
tones
5.5
Thermal
The M710HD thermal solution includes:
Optimized airflow impedance for individual blade and chassis level airflow balancing
Custom air baffling to direct air flow through the components to maintain proper cooling
Custom-designed heat sinks that maintain processor, DIMM, and board-level chip
temperatures within thermal design targets
Highly optimized fan control algorithm:
o
Base fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
o
PID control algorithms are used for both processor, DIMMs, and NDC to maintain
appropriate thermal margin