Dell PowerEdge MX750c EMC Technical Specifications - Page 10

Thermal air restrictions, Thermal, ASHRAE A3 environment

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Table 17. Thermal restriction matrix (continued) Configuration 6 x 2.5-inch BP w/6 drives and 32 DIMMs Test storage SAS drive NVMe drive Ambient temperature 185 W 35°C 35°C 205 W 35°C 35°C 220 W Not supported Not supported 250 W Not supported Not supported 270 W Not supported Not supported Memory 128 GB LRDIMM 3200, 9.4 W, 2 DPC Intel Optane PMem 200 Series, 15-18 W 45°C 30°C 35°C 30°C PCIe card Mezzanine card, Tier2, ≤ 30 W Mini Mezzanine card 45°C 45°C 35°C 35°C 4 x 2.5-inch BP w/4 drives and 32 DIMMs SAS drive NVMe drive 35°C 35°C 35°C 35°C 35°C 45°C 35°C 35°C 35°C 35°C 30°C 35°C 35°C 45°C 45°C 35°C 35°C 35°C Thermal air restrictions Thermal PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate temperature thereby reducing server noise and power consumption. The sensors in the MX750c interact with the chassis management services module which regulates fan speed. All fans which cool the MX750c are contained in the MX7000 chassis. Thermal management of PowerEdge MX750c delivers high performance for the right amount of cooling to components at the lowest fan speeds across a wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature ranges (see Environmental Specifications section). The benefits to you are lower fan power consumption (lower server system power and data center power consumption) and greater acoustical versatility. For detailed information about thermal please consult the MX7000 Technical Guide. ASHRAE A3 environment ● Do not perform a cold startup below 5°C. ● The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft). ● Higher wattage processors, Thermal Design Power(TDP)>140 W are not supported. ● Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported. ● PCIe SSD is not supported. ● Intel Optane PMem 200 Series is not supported. ● 128 GB LRDIMM is not supported. ASHRAE A4 environment ● Do not perform a cold startup below 5°C. ● The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft). ● Higher wattage processors, Thermal Design Power(TDP)>135 W are not supported. ● Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported. 10 Technical specifications

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Table 17. Thermal restriction matrix (continued)
Configuration
6 x 2.5-inch BP w/6 drives and 32
DIMMs
4 x 2.5-inch BP w/4 drives and 32
DIMMs
Test storage
SAS drive
NVMe drive
SAS drive
NVMe drive
Ambient temperature
185 W
35°C
35°C
35°C
35°C
205 W
35°C
35°C
35°C
35°C
220 W
Not supported
Not supported
35°C
35°C
250 W
Not supported
Not supported
35°C
35°C
270 W
Not supported
Not supported
35°C
30°C
Memory
128 GB LRDIMM
3200, 9.4 W, 2
DPC
45°C
35°C
45°C
35°C
Intel Optane PMem
200 Series, 15-18
W
30°C
30°C
35°C
35°C
PCIe card
Mezzanine card,
Tier2, ≤ 30 W
45°C
35°C
45°C
35°C
Mini Mezzanine
card
45°C
35°C
45°C
35°C
Thermal air restrictions
Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption. The sensors in the MX750c interact with the chassis
management services module which regulates fan speed. All fans which cool the MX750c are contained in the MX7000 chassis.
Thermal management of PowerEdge MX750c delivers high performance for the right amount of cooling to components at the
lowest fan speeds across a wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient
temperature ranges (see Environmental Specifications section). The benefits to you are lower fan power consumption (lower
server system power and data center power consumption) and greater acoustical versatility.
For detailed information about thermal please consult the MX7000 Technical Guide.
ASHRAE A3 environment
●
Do not perform a cold startup below 5°C.
●
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
●
Higher wattage processors, Thermal Design Power(TDP)>140 W are not supported.
●
Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported.
●
PCIe SSD is not supported.
●
Intel Optane PMem 200 Series is not supported.
●
128 GB LRDIMM is not supported.
ASHRAE A4 environment
●
Do not perform a cold startup below 5°C.
●
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
●
Higher wattage processors, Thermal Design Power(TDP)>135 W are not supported.
●
Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported.
10
Technical specifications