Dell PowerEdge MX750c EMC Technical Specifications - Page 9

Thermal restriction matrix, Table 13. Shared requirements across all categories continued

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Table 13. Shared requirements across all categories (continued) Temperature Specifications Maximum temperature gradient (applies to both operation and non-operation) 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15 minutes), 5°C in an hour* (41°F in an hour) for tape NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change. Non-operational temperature limits Non-operational humidity limits Maximum non-operational altitude Maximum operational altitude -40 to 65°C (-104 to 149°F) 5% to 95% RH with 27°C (80.6°F) maximum dew point 12,000 meters (39,370 feet) 3,048 meters (10,000 feet) Table 14. Maximum vibration specifications Maximum vibration Specifications Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations) Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested) Table 15. Maximum shock pulse specifications Maximum shock pulse Specifications Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms. Thermal restriction matrix Table 16. PowerEdge MX750c thermal restriction - processor configuration ASHRAE A2 Ambient Support 30 ° C 35 ° C Processor 270 W processor in 4 drives backplane configuration with 4 NVMes Processor with 220 W and above has to be limited in 4 drives backplane configuration. A3/A4 40 ° C (ASHRAE A3) / 45 ° C (ASHRAE A4) Not supported for processor TDP >140 W in A3 Not supported for processor TDP >135 W in A4 Table 17. Thermal restriction matrix Configuration 6 x 2.5-inch BP w/6 drives and 32 DIMMs Test storage SAS drive NVMe drive Ambient temperature 105 W 45°C 35°C 120 W 45°C 35°C Processor TDP 125 W 135 W 45°C 45°C 35°C 35°C 150 W 35°C 35°C 165 W 35°C 35°C 4 x 2.5-inch BP w/4 drives and 32 DIMMs SAS drive NVMe drive 45°C 45°C 45°C 45°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C Technical specifications 9

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Table 13. Shared requirements across all categories (continued)
Temperature
Specifications
Maximum temperature gradient (applies to both
operation and non-operation)
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15
minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE:
* - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.
Non-operational temperature limits
-40 to 65°C (-104 to 149°F)
Non-operational humidity limits
5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude
12,000 meters (39,370 feet)
Maximum operational altitude
3,048 meters (10,000 feet)
Table 14. Maximum vibration specifications
Maximum vibration
Specifications
Operating
0.26 G
rms
at 5 Hz to 350 Hz (all operation orientations)
Storage
1.88 G
rms
at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
Table 15. Maximum shock pulse specifications
Maximum shock pulse
Specifications
Operating
Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.
Storage
Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Thermal restriction matrix
Table 16. PowerEdge MX750c thermal restriction - processor configuration
ASHRAE
A2
A3/A4
Ambient Support
30 ° C
35 ° C
40 ° C (ASHRAE A3) / 45 °
C (ASHRAE A4)
Processor
270 W processor in 4 drives
backplane configuration with
4 NVMes
Processor with 220 W
and above has to be
limited in 4 drives backplane
configuration.
Not supported for processor
TDP >140 W in A3
Not supported for processor
TDP >135 W in A4
Table 17. Thermal restriction matrix
Configuration
6 x 2.5-inch BP w/6 drives and 32
DIMMs
4 x 2.5-inch BP w/4 drives and 32
DIMMs
Test storage
SAS drive
NVMe drive
SAS drive
NVMe drive
Ambient temperature
Processor TDP
105 W
45°C
35°C
45°C
35°C
120 W
45°C
35°C
45°C
35°C
125 W
45°C
35°C
45°C
35°C
135 W
45°C
35°C
45°C
35°C
150 W
35°C
35°C
35°C
35°C
165 W
35°C
35°C
35°C
35°C
Technical specifications
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