Fujitsu MAF3364LC Manual/User Guide - Page 84

INSTALLATION, 5.1 Notes on Handling Drives - hard drive

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CHAPTER 5 INSTALLATION 5.1 Notes on Handling Drives 5.2 Connections 5.3 Setting Terminals 5.4 Mounting Drives 5.5 Connecting Cables 5.6 Confirming Operations after Installation and Preparation for Use 5.7 Dismounting Drives This chapter describes the notes on handling drives, connections, setting switches and plugs, mounting drives, connecting cables, confirming drive operations after installation and preparation for use, and dismounting drives. 5.1 Notes on Handling Drives The items listed in the specifications in Table 2.1 must be strictly observed. (1) General notes a) Do not give the drive shocks or vibrations exceeding the value defined in the standard because it may cause critical damage to the drive. Especially be careful when unpacking. b) Do not leave the drive in a dirty or contaminated environment. c) Since static discharge may destroy the CMOS semiconductors in the drive, note the following after unpacking: • Use an antistatic mat and body grounding when handling the drive. • Hold the DE when handling the drive. Do not touch PCAs except for setting. (2) Unpackaging a) Use a flat work area. Check that the "This Side Up" sign side is up. Handle the package on soft material such as a rubber mat, not on hard material such as a desk. b) Be careful not to give excess pressure to the internal unit when removing cushions. C141-E064-03EN 5 - 1

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C141-E064-03EN
5 - 1
CHAPTER 5
INSTALLATION
5.1
Notes on Handling Drives
5.2
Connections
5.3
Setting Terminals
5.4
Mounting Drives
5.5
Connecting Cables
5.6
Confirming Operations after Installation and Preparation
for Use
5.7
Dismounting Drives
This chapter describes the notes on handling drives, connections, setting switches and plugs, mounting
drives, connecting cables, confirming drive operations after installation and preparation for use, and
dismounting drives.
5.1
Notes on Handling Drives
The items listed in the specifications in Table 2.1 must be strictly observed.
(1)
General notes
a)
Do not give the drive shocks or vibrations exceeding the value defined in the standard
because it may cause critical damage to the drive.
Especially be careful when unpacking.
b)
Do not leave the drive in a dirty or contaminated environment.
c)
Since static discharge may destroy the CMOS semiconductors in the drive, note the
following after unpacking:
•
Use an antistatic mat and body grounding when handling the drive.
•
Hold the DE when handling the drive.
Do not touch PCAs except for setting.
(2)
Unpackaging
a)
Use a flat work area.
Check that the "This Side Up" sign side is up.
Handle the package
on soft material such as a rubber mat, not on hard material such as a desk.
b)
Be careful not to give excess pressure to the internal unit when removing cushions.