Harman Kardon TA12 Owners Manual - Page 9

Jharman Akardon

Page 9 highlights

_void Overheating: When using the soldering iron (35 watts or less), do not overheat the component terminals or the copper foil. Excessive heat (applying soldering iron longer than necessary, using a higher wattage soldering iron than recommended, or using a solder gun) may cause the bond between the board and foil to break. This will necessitate replacement or repair of the foil connection. Tools and Materials Required: (1) Low wattage soldering iron with a small point or wedge (rating should not exceed 35 watts). (2) Small wire brush. (3) 600J0 tin, 40% lead, low temperature rosin core solder. (4) Thin bladed knife. (5) Small wire pick, or soldering aid. REPLACING COMPONENTS Soldering Replacement Component to Old Leads: Cut the leads where they enter the defective component. Clean off the ends of the leads, leaving as much of the leads as possible. Make a small loop in each lead of the replacement component and slide the loops over the remaining leads of the old component. Caution should be taken not to overheat the connection since the copper foil may peel or the original component lead may fall out of the board. This is possible due to heat transfer through the leads. The lead length of the replacement part should be kept reasonably short to provide some mechanical rigidity. Unsoldering and Resoldering Components: To test a component or if the component is mounted in such a manner that the above method can not be used (such as vertically mounted capacitors, etc.) the component can be replaced by unsoldering it. This procedure should be used whenever it is necessary to unsolder any connections to replace defective components. (a) Heat the connection on the wiring side of the board with a small soldering iron. When the solder melts, brush away the solder. Do not overheat the 'connection. In the process of removing the solder, caution must be taken to prevent excessive heating. Therefore, do not leave the iron on the connection while brushing away the solder. Melt the solder, remove the iron and quickly brush away the solder. It may require more than one heating and brushing process to completely remove the solder. (b) Insert a knife blade between the wiring foil and the "bent-over" component lead and bend the lead perpendicular to the board. (It may be necessary to apply the soldering iron to the connection while performing 'this step as it is sometimes difficult to completely break the connection by brushing.) Do not overheat the connection. (c) While applying the soldering iron to the connections, "wiggle" the component until it is removed. (d) Remove any small particles of solder using a clean cloth dipped in solvent. (e) A thin film of solder may remain over the hole through the board after removing the component. Pierce the film with the lead from the new component after heating the solder film with the soldering iron. (f) Insert the leads of the new component through the holes provided. Cut to desired length and bend over the ends against the copper foil. Resolder the connection with 60/40 low temperature solder. Harman-Kardon high fidelity instruments incorporate advanced production techniques as well as advanced circuit features. They reflect the highest state of the art of fine audio equipment. We hope your unit provides you with many hours of listening enjoyment. Our Customer Service Department is maintained to answer your correspondence about High Fidelity and to make recommendation of appropriate companion accessories. Please feel free to write without obligation. harman kardon 520 MAIN STREET 8 WESTBURY. L. I.. N. Y.

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_void
Overheating:
When
using
the
soldering
iron
(35
watts
or
less),
do
not
overheat
the
component
terminals
or
the
copper
foil.
Excessive
heat
(applying
soldering
iron
longer
than
necessary,
using
a
higher
wattage
soldering
iron
than
recommended,
or
using
a
solder
gun)
may
cause
the
bond
between
the
board
and
foil
to
break.
This
will
necessitate
replacement
or
repair
of
the
foil
connection.
Tools
and
Materials
Required:
(1)
Low
wattage
soldering
iron
with
a
small
point
or
wedge
(rating
should
not
exceed
35
watts).
(2)
Small
wire
brush.
(3)
60
0
J
0
tin,
40%
lead,
low
temperature
rosin
core
solder.
(4)
Thin
bladed
knife.
(5)
Small
wire
pick,
or
soldering
aid.
REPLACING
COMPONENTS
Soldering
Replacement
Component
to
Old
Leads:
Cut
the
leads
where
they
enter
the
defective
com-
ponent.
Clean
off
the
ends
of
the
leads,
leaving
as
much
of
the
leads
as
possible.
Make
a
small
loop
in
each
lead
of
the
replacement
component
and
slide
the
loops
over
the
remaining
leads
of
the
old
component.
Cau-
tion
should
be
taken
not
to
overheat
the
connection
since
the
copper
foil
may
peel
or
the
original
component
lead
may
fall
out
of
the
board.
This
is
possible
due
to
heat
transfer
through
the
leads.
The
lead
length
of
the
re-
placement
part
should
be
kept
reasonably
short
to
pro-
vide
some
mechanical
rigidity.
Unsoldering
and
Resoldering
Components:
To
test
a
component
or
if
the
component
is
mounted
in
such
a
manner
that
the
above
method
can
not
be
used
(such
as
vertically
mounted
capacitors,
etc.)
the
com-
ponent
can
be
replaced
by
unsoldering
it.
This
proce-
dure
should
be
used
whenever
it
is
necessary
to
unsolder
any
connections
to
replace
defective
components.
(a)
Heat
the
connection
on
the
wiring
side
of
the
board
with
a
small
soldering
iron.
When
the
solder
melts,
brush
away
the
solder.
Do
not
overheat
the
'con-
nection.
In
the
process
of
removing
the
solder,
caution
must
be
taken
to
prevent
excessive
heating.
Therefore,
do
not
leave
the
iron
on
the
connection
while
brushing
away
the
solder.
Melt
the
solder,
remove
the
iron
and
quickly
brush
away
the
solder.
It
may
require
more
than
one
heating
and
brushing
process
to
completely
re-
move
the
solder.
(b)
Insert
a
knife
blade
between
the
wiring
foil
and
the
"bent
-over"
component
lead
and
bend
the
lead
perpendicular
to
the
board.
(It
may
be
necessary
to
apply
the
soldering
iron
to
the
connection
while
performing
'this
step
as
it
is
sometimes
difficult
to
completely
break
the
connection
by
brushing.)
Do
not
overheat
the
con-
nection.
(c)
While
applying
the
soldering
iron
to
the
con-
nections,
"wiggle"
the
component
until
it
is
removed.
(d)
Remove
any
small
particles
of
solder
using
a
clean
cloth
dipped
in
solvent.
(e)
A
thin
fi
lm
of
solder
may
remain
over
the
hole
through
the
board
after
removing
the
component.
Pierce
the
fi
lm
with
the
lead
from
the
new
component
after
heating
the
solder
fi
lm
with
the
soldering
iron.
(f)
Insert
the
leads
of
the
new
component
through
the
holes
provided.
Cut
to
desired
length
and
bend
over
the
ends
against
the
copper
foil.
Resolder
the
con-
nection
with
60/40
low
temperature
solder.
Harman-Kardon
high
fidelity
instruments
incorporate
advanced
production
techniques
as
well
as
advanced
circuit
features.
They
reflect
the
highest
state
of
the
art
of
fine
audio
equipment.
We
hope
your
unit
provides
you
with
many
hours
of
listening
enjoyment.
Our
Customer
Service
Department
is
maintained
to
answer
your
correspondence
about
High
Fidelity
and
to
make
recommendation
of
appropriate
companion
accessories.
Please
feel
free
to
write
without
obligation.
harman
kardon
520
MAIN
STREET
8
WESTBURY.
L.
I..
N.
Y.