HP 3115m HP 3115m Notebook PC - Maintenance and Service Guide - Page 72
and the heat sink that services it.
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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink and system board spare part kits. The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with discrete memory. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Reverse this procedure to install the heat sink. 64 Chapter 4 Removal and replacement procedures
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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is included
with the heat sink and system board spare part kits.
The following illustration shows the replacement thermal material locations on a computer model
equipped with an AMD processor and a graphics subsystem with discrete memory. Thermal paste is
used on the processor
(1)
and the heat sink section
(2)
that services it.
Reverse this procedure to install the heat sink.
64
Chapter 4
Removal and replacement procedures