HP 4410t HP 4410t Mobile Thin Client - Maintenance and Service Guide - Page 64

When replacing the heat sink

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Page 64 highlights

Removal and replacement procedures ✎ The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed: ■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. Replacement thermal material is included with all system board, heat sink, and processor spare part kits. ✎ When replacing the heat sink, be sure to remove the fan from the defective heat sink and install it on the replacement heat sink. See "Fan" on page 4-32 for fan removal instructions. Reverse this procedure to install the heat sink. Maintenance and Service Guide 4-31

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Removal and replacement procedures
Maintenance and Service Guide
4–31
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time
the heat sink is removed:
■
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
■
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
Replacement thermal material is included with all system board, heat sink, and processor spare part kits.
✎
When replacing the heat sink, be sure to remove the fan from the defective heat sink and install it on the
replacement heat sink. See
“Fan” on page 4-32
for fan removal instructions.
Reverse this procedure to install the heat sink.