HP Pavilion 11-e100 210 G1 Notebook PC Pavilion 11 Notebook PC Pavilion TouchS - Page 83

Heat sink, and then remove the following components

Page 83 highlights

6. Remove the system board (3) by sliding it up and to the left an angle. Reverse this procedure to install the system board. Heat sink Description HP 210 G1 Notebook PC HP Pavilion TouchSmart 11 Notebook, HP Pavilion 11 Notebook, or HP 215 G1 Notebook PC computer models Spare part number 761242-001 730902-001 Before removing the heat sink, follow these steps: 1. Turn off the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2. Disconnect the power from the computer by unplugging the power cord from the computer. 3. Disconnect all external devices from the computer. 4. Remove the battery (see Battery on page 40), and then remove the following components: a. Service door (see Service door on page 41) b. Hard drive (see Hard drive on page 42) c. Display assembly (see Display assembly on page 53) d. Bottom cover (see Bottom cover on page 61) Component replacement procedures 73

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6.
Remove the system board
(3)
by sliding it up and to the left an angle.
Reverse this procedure to install the system board.
Heat sink
Description
Spare part number
HP 210 G1 Notebook PC
761242-001
HP Pavilion TouchSmart 11 Notebook, HP Pavilion 11 Notebook, or HP 215 G1 Notebook PC
computer models
730902-001
Before removing the heat sink, follow these steps:
1.
Turn off the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2.
Disconnect the power from the computer by unplugging the power cord from the computer.
3.
Disconnect all external devices from the computer.
4.
Remove the battery (see
Battery
on page
40
), and then remove the following components:
a.
Service door (see
Service door
on page
41
)
b.
Hard drive (see
Hard drive
on page
42
)
c.
Display assembly (see
Display assembly
on page
53
)
d.
Bottom cover (see
Bottom cover
on page
61
)
Component replacement procedures
73