HP Pavilion dv6-3200 HP Pavilion dv6 Entertainment PC - Maintenance and Servic - Page 92
A thermal pad is used on the system board PCH chip
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Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. NOTE: Computer models equipped with a graphics subsystem with UMA memory have replacement thermal material locations as shown in the following illustration: ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the system board PCH chip (3) and the heat sink section (4) that services it Reverse this procedure to install the fan/heat sink assembly. 82 Chapter 4 Removal and replacement procedures
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor
spare part kits.
NOTE:
Computer models equipped with a graphics subsystem with UMA memory have replacement
thermal material locations as shown in the following illustration:
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the system board PCH chip
(3)
and the heat sink section
(4)
that
services it
Reverse this procedure to install the fan/heat sink assembly.
82
Chapter 4
Removal and replacement procedures