Intel 640 User Guide - Page 42
Environmental Reliability Testing
UPC - 683728178901
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Intel® Thermal/Mechanical Reference Design Information R 5.2 Environmental Reliability Testing 5.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. 5.2.1.1 Random Vibration Test Procedure Duration: 10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.13 G RMS Figure 8. Random Vibration PSD 5.2.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops). • Profile: 50 G trapezoidal waveform, 11 ms duration, 170 in/sec minimum velocity change. • Setup: Mount sample board on test fixture. 42 Thermal/Mechanical Design Guide