Intel 640 User Guide - Page 48
Reference Attach Mechanism
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Intel® Thermal/Mechanical Reference Design Information R 5.7 Reference Attach Mechanism 5.7.1 Structural Design Strategy Structural design strategy for the Intel RCBFH-3 Reference Solution is to minimize upward board deflection during shock to help protect the LGA775 socket. The reference design uses a high clip stiffness that resists local board curvature under the heatsink, and minimizes, in particular, upward board deflection (Figure 12). In addition, a moderate preload provides initial downward deflection. Figure 12. Upward Board Deflection during Shock Shock Load Less curvature in region under stiff clip The reference metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. The nominal preload provided by the Intel RCBFH-3 reference design is 191.3 N +/- 44.5 N [43 lb ± 10 lb]. Note: Intel reserves the right to make changes and modifications to the design as necessary to the Intel RCBFH-3 reference design, in particular the clip and fastener. 48 Thermal/Mechanical Design Guide