Intel 640 User Guide - Page 46
ATX Reference Thermal Mechanical Solution for the, Intel, Pentium, Processor in the 775-Land LGA,
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Intel® Thermal/Mechanical Reference Design Information R 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package The reference thermal solution is an active air-cooled design, with a fan installed at the top of the heatsink. This solution is called the Intel® Radial Curved Bifurcated Fin Heatsink Reference Design (Intel® RCBFH-3 Reference Design). The reference solution is compliant with the reference ATX motherboard keep-out and height recommendations defined in Section 5.5. The solution comes as an integrated assembly (Figure 10). An exploded view of the assembly is provided in Figure 11. The solution is purposely designed without a fan guard to optimize thermal and acoustic performance. Note: If this fan design is used in your product and you will deliver it to end use customers, you have the responsibility to determine an adequate level of protection (e.g., protection barriers, a cage, or an interlock) against contact with the energized fan by the user during user servicing. Table 4. Intel® RCBFH-3 Reference Design Performance Fan Set Point Fan Speed High Low 3600 RPM 2400 RPM Validated Thermal Performance Ψca (Mean + 3σ) 0.29 °C/W 0.325 °C/W Validated Acoustic Performance (LwAd) 5.5 BA 4.5 BA T Assumption A T = 38 °C A TA = 30 °C Note: RCBFH-3 performance in Table 4 is relative to the Intel Pentium® 4 Processor 5xx sequence. Refer to Table 2 for performance of the RCBFH-3 with the other processors. Figure 10. Intel® RCBFH-3 Reference Design Extrusion + Copper Core Fan Clip Fastener 46 Thermal/Mechanical Design Guide