Intel D845GBV Product Supplement Document for the Intel Desktop Board D845GBV - Page 32
Reliability, 8 Thermal Considerations
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Product Supplement Document for the Intel Desktop Board D845GBV 2.7 Reliability The mean time between failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board D845GBV MTBF is 107,183.8933 hours. 2.8 Thermal Considerations 2.8.1 High Temperature Zones CAUTION Ensure that the ambient temperature does not exceed the Desktop Board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the Environmental specifications section in the Technical Product Specification for Intel Desktop Boards using the Intel 845G Chipset. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (item A in Figure 10) can reach a temperature of up to 85 oC in an open chassis. 32