Intel D945GCLF2D Product Guide - Page 52

Lead-free 2LI/Pb-free 2LI Board, Table 13. Lead-Free Second Level Interconnect Marks

Get Intel D945GCLF2D - Desktop Board With Integrated Atom Processor Motherboard PDF manuals and user guides View all Intel D945GCLF2D manuals
Add to My Manuals
Save this manual to your list of manuals

Page 52 highlights

Intel Desktop Board D945GCLF2D Product Guide Lead-free 2LI/Pb-free 2LI Board The electronics industry is transitioning to European Union (EU) Restriction of Hazardous Substances (RoHS)-compliant products. The RoHS legislation restricts the use of six materials. One of these restricted materials is lead. Lead is the most common and problematic of the RoHS restricted materials. There are exemptions in RoHS that allow the use of lead in some very limited locations in electronic products. Maximum lead concentration values have been established for RoHS-compliant electronic products that allow up to 1000 ppm of lead. Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant products. In this case, the term "Lead-free/Pb-free" means that lead has been removed where required by the RoHS legislation but still may exist as an impurity below 1000 ppm. The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI). The balls, leads, or pads used to connect the component to a printed circuit board are lead-free, but the first level interconnect (FLI) is not lead-free. The use of lead in the FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect exemption. Intel Desktop Board D945GCLF2D is a lead-free second level interconnect product. Table 13 shows the lead-free second level interconnect marks as they appear on the board and accompanying collateral. These marks are based on JEDEC standard J-STD-609, "Marking and Labeling of Components, PCBs and PCBAs to Identify Lead, Lead Free and Other Attributes." For more information concerning Intel's lead-free initiatives, refer to http://www.intel.com/technology/silicon/leadfree.htm. Table 13. Lead-Free Second Level Interconnect Marks Description Mark This symbol is used to identify electrical and electronic assemblies and components in which the Pb concentration level in the Desktop Board substrate and the solder connections from the board to or the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm). or 52

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
Intel Desktop Board D945GCLF2D Product Guide
52
Lead-free 2LI/Pb-free 2LI Board
The electronics industry is transitioning to European Union (EU) Restriction of
Hazardous Substances (RoHS)-compliant products.
The RoHS legislation restricts the
use of six materials.
One of these restricted materials is lead.
Lead is the most
common and problematic of the RoHS restricted materials.
There are exemptions in RoHS that allow the use of lead in some very limited locations
in electronic products.
Maximum lead concentration values have been established for
RoHS-compliant electronic products that allow up to 1000 ppm of lead.
Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant
products.
In this case, the term "Lead-free/Pb-free" means that lead has been
removed where required by the RoHS legislation but still may exist as an impurity
below 1000 ppm.
The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI).
The balls, leads, or pads used to connect the component to a printed circuit board are
lead-free, but the first level interconnect (FLI) is not lead-free.
The use of lead in the
FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect
exemption.
Intel Desktop Board D945GCLF2D is a lead-free second level interconnect product.
Table 13 shows the lead-free second level interconnect marks as they appear on the
board and accompanying collateral.
These marks are based on JEDEC standard
J-STD-609, “Marking and Labeling of Components, PCBs and PCBAs to Identify Lead,
Lead Free and Other Attributes.”
For more information concerning Intel’s lead-free initiatives, refer to
.
Table 13. Lead-Free Second Level Interconnect Marks
Description
Mark
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the Desktop Board
substrate and the solder
connections from the board to
the components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
or
or