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Intel DC53427HYE Technical Product Specification - Page 60

Reliability, Environmental

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Intel NUC D53427RKE Technical Product Specification 2.8 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is 71,537 hours. 2.9 Environmental Table 21 lists the environmental specifications for the board. Table 21. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -40 °C to +60 °C 0 °C to +50 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® NUC Board D53427RKE Technical Product Specification	1
Revision History	2
Disclaimer	2
Board Identification Information	3
Errata	3
Preface	5
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout (Top)	13
1.1.3 Board Layout (Bottom)	15
1.1.4 Block Diagram	17
1.2 Online Support	18
1.3 Processor	18
1.4 System Memory	19
1.4.1 Memory Configurations	20
1.5 Intel® QS77 Express Chipset	22
1.5.1 Direct Media Interface (DMI)	22
1.5.2 Display Interfaces	22
1.6 Graphics Subsystem	23
1.6.1 Integrated Graphics	23
1.6.2 USB	25
1.6.3 AHCI Mode	25
1.7 Real-Time Clock Subsystem	26
1.8 LAN Subsystem	26
1.8.1 Intel® 82579LM Gigabit Ethernet Controller	27
1.8.2 LAN Subsystem Software	27
1.8.3 RJ-45 LAN Connector with Integrated LEDs	28
1.9 Hardware Management Subsystem	29
1.9.1 Hardware Monitoring	29
1.9.2 Fan Monitoring	29
1.9.3 Thermal Solution	30
1.10 Power Management	31
1.10.1 ACPI	31
1.10.2 Hardware Support	33
1.11 Intel® Security and Manageability Technologies	36
1.11.1 Intel® vPro™ Technology	36
1.11.2 Intel® Small Business Technology	39
2 Technical Reference	41
2.1 Memory Resources	41
2.1.1 Addressable Memory	41
2.2 Connectors and Headers	42
2.2.1 Back Panel Connectors	43
2.2.2 Connectors and Headers (Bottom)	44
2.3 BIOS Setup Configuration Jumper	52
2.4 Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header	53
2.5 Mechanical Considerations	55
2.5.1 Form Factor	55
2.6 Electrical Considerations	56
2.6.1 Power Supply Considerations	56
2.6.2 Fan Header Current Capability	57
2.7 Thermal Considerations	57
2.8 Reliability	60
2.9 Environmental	60
3 Overview of BIOS Features	61
3.1 Introduction	61
3.2 BIOS Flash Memory Organization	62
3.3 System Management BIOS (SMBIOS)	62
3.4 Legacy USB Support	62
3.5 BIOS Updates	63
3.5.1 Language Support	63
3.5.2 Custom Splash Screen	64
3.6 BIOS Recovery	64
3.7 Boot Options	65
3.7.1 Network Boot	65
3.7.2 Booting Without Attached Devices	65
3.7.3 Changing the Default Boot Device During POST	65
3.8 Hard Disk Drive Password Security Feature	66
3.9 BIOS Security Features	67
4 Error Messages and Blink Codes	69
4.1 Front-panel Power LED Blink Codes	69
4.2 BIOS Error Messages	69
5 Regulatory Compliance and Battery Disposal Information	71
5.1 Regulatory Compliance	71
5.1.1 Safety Standards	71
5.1.2 European Union Declaration of Conformity Statement	72
5.1.3 Product Ecology Statements	73
5.1.4 EMC Regulations	74
5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance	76
5.1.6 Regulatory Compliance Marks (Board Level)	77