Intel DQ43AP Product Specification - Page 7

Regulatory Compliance and Battery Disposal Information, s, Tables

Page 7 highlights

Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 79 5.1.1 Safety Standards 79 5.1.2 European Union Declaration of Conformity Statement 80 5.1.3 Product Ecology Statements 81 5.1.4 EMC Regulations 85 5.1.5 Product Certification Markings (Board Level 86 5.2 Battery Disposal Information 87 Figures 1. Major Board Components 11 2. Block Diagram 13 3. Memory Channel and DIMM Configuration 18 4. Back Panel Audio Connector Options 24 5. LAN Connector LED Locations 26 6. Thermal Sensors and Fan Headers 31 7. Location of the Standby Power Indicator LED 38 8. Detailed System Memory Address Map 40 9. Back Panel Connectors 43 10. Component-side Connectors and Headers 44 11. Connection Diagram for Front Panel Header 49 12. Connection Diagram for Front Panel USB Headers 52 13. Location of the BIOS Configuration Jumper Block 53 14. Board Dimensions 55 15. Localized High Temperature Zones 58 Tables 1. Feature Summary 9 2. Board Components Shown in Figure 1 12 3. Supported Memory Configurations 16 4. Audio Jack Retasking Support 23 5. LAN Connector LED States 26 6. Effects of Pressing the Power Switch 32 7. Power States and Targeted System Power 33 8. Wake-up Devices and Events 34 9. System Memory Map 41 10. Component-side Connectors and Headers Shown in Figure 10 45 11. Front Panel Audio Header for HD Audio 46 12. Front Panel Audio Header for AC '97 Audio 46 13. Serial ATA Connectors 46 14. Serial Port Header 46 15. Chassis Intrusion Header 47 16. Front, Rear, and Processor (4-Pin) Fan Header 47 17. Processor Core Power Connector 48 18. Main Power Connector 48 vii

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Contents
vii
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
79
5.1.1
Safety Standards
..................................................................
79
5.1.2
European Union Declaration of Conformity Statement
................
80
5.1.3
Product Ecology Statements
...................................................
81
5.1.4
EMC Regulations
..................................................................
85
5.1.5
Product Certification Markings (Board Level)
.............................
86
5.2
Battery Disposal Information
.............................................................
87
Figures
1.
Major Board Components
..................................................................
11
2.
Block Diagram
................................................................................
13
3.
Memory Channel and DIMM Configuration
...........................................
18
4.
Back Panel Audio Connector Options
..................................................
24
5.
LAN Connector LED Locations
............................................................
26
6.
Thermal Sensors and Fan Headers
.....................................................
31
7.
Location of the Standby Power Indicator LED
.......................................
38
8.
Detailed System Memory Address Map
...............................................
40
9.
Back Panel Connectors
.....................................................................
43
10. Component-side Connectors and Headers
...........................................
44
11. Connection Diagram for Front Panel Header
........................................
49
12. Connection Diagram for Front Panel USB Headers
................................
52
13. Location of the BIOS Configuration Jumper Block
.................................
53
14. Board Dimensions
...........................................................................
55
15. Localized High Temperature Zones
.....................................................
58
Tables
1.
Feature Summary
..............................................................................
9
2.
Board Components Shown in Figure 1
................................................
12
3.
Supported Memory Configurations
.....................................................
16
4.
Audio Jack Retasking Support
...........................................................
23
5.
LAN Connector LED States
................................................................
26
6.
Effects of Pressing the Power Switch
..................................................
32
7.
Power States and Targeted System Power
...........................................
33
8.
Wake-up Devices and Events
............................................................
34
9.
System Memory Map
.......................................................................
41
10. Component-side Connectors and Headers Shown in Figure 10
................
45
11. Front Panel Audio Header for HD Audio
...............................................
46
12. Front Panel Audio Header for AC ’97 Audio
..........................................
46
13. Serial ATA Connectors
......................................................................
46
14. Serial Port Header
...........................................................................
46
15. Chassis Intrusion Header
..................................................................
47
16. Front, Rear, and Processor (4-Pin) Fan Header
....................................
47
17. Processor Core Power Connector
........................................................
48
18. Main Power Connector
......................................................................
48