Intel DX79TO Technical Product Specification - Page 9

Regulatory Compliance and Battery Disposal Information, s, Tables - memory configuration

Page 9 highlights

Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 81 5.1.1 Safety Standards 81 5.1.2 European Union Declaration of Conformity Statement 82 5.1.3 Product Ecology Statements 83 5.1.4 EMC Regulations 85 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance 88 5.1.6 Regulatory Compliance Marks (Board Level 89 5.2 Battery Disposal Information 90 Figures 1. Major Board Components 13 2. Block Diagram 15 3. Memory Channel and DIMM Configuration 20 4. Back Panel Audio Connectors 25 5. LAN Connector LED Locations 27 6. Thermal Sensors and Fan Headers 29 7. Location of Board Status LEDs 37 8. Location of the Onboard Power and Reset Buttons 39 9. Detailed System Memory Address Map 42 10. Back Panel Connectors 44 11. I/O Shield Reference Diagram 45 12. Component-side Connectors and Headers 46 13. Connection Diagram for Front Panel Header 52 14. Connection Diagram for Front Panel USB 2.0 Headers 54 15. Location of the Jumper Block 55 16. Board Dimensions 57 17. Localized High Temperature Zones 61 Tables 1. Specification Changes or Clarifications iii 2. Feature Summary 11 3. Components Shown in Figure 1 14 4. Supported Memory Configurations 18 5. Audio Jack Support 24 6. LAN Connector LED States 27 7. Effects of Pressing the Power Switch 30 8. Power States and Targeted System Power 31 9. Wake-up Devices and Events 32 10. Board Status LEDs 38 11. System Memory Map 43 12. Component-side Connectors and Headers Shown in Figure 12 47 13. Front Panel Audio Header for Intel HD Audio 48 14. Front Panel Audio Header for AC '97 Audio 48 ix

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Contents
ix
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
......................................................................
81
5.1.1
Safety Standards
...................................................................
81
5.1.2
European Union Declaration of Conformity Statement
................
82
5.1.3
Product Ecology Statements
...................................................
83
5.1.4
EMC Regulations
...................................................................
85
5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
.................
88
5.1.6
Regulatory Compliance Marks (Board Level)
.............................
89
5.2
Battery Disposal Information
..............................................................
90
Figures
1.
Major Board Components
..................................................................
13
2.
Block Diagram
..................................................................................
15
3.
Memory Channel and DIMM Configuration
............................................
20
4.
Back Panel Audio Connectors
.............................................................
25
5.
LAN Connector LED Locations
.............................................................
27
6.
Thermal Sensors and Fan Headers
......................................................
29
7.
Location of Board Status LEDs
............................................................
37
8.
Location of the Onboard Power and Reset Buttons
................................
39
9.
Detailed System Memory Address Map
................................................
42
10. Back Panel Connectors
......................................................................
44
11. I/O Shield Reference Diagram
............................................................
45
12. Component-side Connectors and Headers
............................................
46
13. Connection Diagram for Front Panel Header
.........................................
52
14. Connection Diagram for Front Panel USB 2.0 Headers
...........................
54
15. Location of the Jumper Block
.............................................................
55
16. Board Dimensions
.............................................................................
57
17. Localized High Temperature Zones
.....................................................
61
Tables
1.
Specification Changes or Clarifications
...................................................
iii
2.
Feature Summary
.............................................................................
11
3.
Components Shown in Figure 1
..........................................................
14
4.
Supported Memory Configurations
......................................................
18
5.
Audio Jack Support
...........................................................................
24
6.
LAN Connector LED States
.................................................................
27
7.
Effects of Pressing the Power Switch
...................................................
30
8.
Power States and Targeted System Power
...........................................
31
9.
Wake-up Devices and Events
.............................................................
32
10. Board Status LEDs
............................................................................
38
11. System Memory Map
........................................................................
43
12. Component-side Connectors and Headers Shown in Figure 12
................
47
13. Front Panel Audio Header for Intel HD Audio
........................................
48
14. Front Panel Audio Header for AC ’97 Audio
...........................................
48