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Intel E6420 Data Sheet - Page 116

Thermal Module Assembly Power Supply

UPC - 735858192569

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Balanced Technology Extended (BTX) Boxed Processor Specifications 8.2 Electrical Requirements 8.2.1 Thermal Module Assembly Power Supply The boxed processor's Thermal Module Assembly (TMA) requires a +12 V power supply. The TMA will include power cable to power the integrated fan and will plug into the 4wire fan header on the baseboard. The power cable connector and pinout are shown in Figure 45. Baseboards must provide a compatible power header to support the boxed processor. Table 40contains specifications for the input and output signals at the TMA. The TMA outputs a SENSE signal, which is an open-collector output that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system board-mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND. The TMA receives a Pulse Width Modulation (PWM) signal from the motherboard from the 4th pin of the connector labeled as CONTROL. Note: Figure 45. The boxed processor's TMA requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control. The power header on the baseboard must be positioned to allow the TMA power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself. Figure 46 shows the location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 4.33 inches from the center of the processor socket. Boxed Processor TMA Power Cable Connector Description 1 2 34 Pin Signal 1 GND 2 +12 V 3 SENSE 4 CONTROL Straight square pin, 4-pin terminal housing with polarizing ribs and friction locking ramp. 0.100" pitch, 0.025" square pin width. Match with straight pin, friction lock header on mainboard. B d P P C bl 116 Datasheet

Section	Page
Contents	3
Figures	5
Tables	6
Revision History	7
Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Sequence Features	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Terminology	12
1.2 References	14
Table 1. Reference Documents	14
2 Electrical Specifications	15
2.1 Power and Ground Lands	15
2.2 Decoupling Guidelines	15
2.2.1 VCC Decoupling	15
2.2.2 Vtt Decoupling	15
2.2.3 FSB Decoupling	16
2.3 Voltage Identification	16
Table 2. Voltage Identification Definition	17
2.4 Market Segment Identification (MSID)	18
Table 3. Market Segment Selection Truth Table for MSID[1:0], , ,	18
2.5 Reserved, Unused, and TESTHI Signals	18
2.6 Voltage and Current Specification	19
2.6.1 Absolute Maximum and Minimum Ratings	19
Table 4. Absolute Maximum and Minimum Ratings	20
2.6.2 DC Voltage and Current Specification	20
Table 5. Voltage and Current Specifications	20
Table 6. VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache	22
Figure 1. VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache	23
Table 7. VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache	24
Figure 2. VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache	25
2.6.3 VCC Overshoot	25
Table 8. VCC Overshoot Specifications	25
Figure 3. VCC Overshoot Example Waveform	26
2.6.4 Die Voltage Validation	26
2.7 Signaling Specifications	26
2.7.1 FSB Signal Groups	27
Table 9. FSB Signal Groups	27
Table 10. Signal Characteristics	28
Table 11. Signal Reference Voltages	28
2.7.2 CMOS and Open Drain Signals	28
2.7.3 Processor DC Specifications	29
Table 12. GTL+ Signal Group DC Specifications	29
Table 13. Open Drain and TAP Output Signal Group DC Specifications	29
Table 14. CMOS Signal Group DC Specifications	30
2.7.3.1 GTL+ Front Side Bus Specifications	30
Table 15. GTL+ Bus Voltage Definitions	30
2.7.4 Clock Specifications	31
2.7.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
Table 16. Core Frequency to FSB Multiplier Configuration	31
2.7.6 FSB Frequency Select Signals (BSEL[2:0])	31
Table 17. BSEL[2:0] Frequency Table for BCLK[1:0]	32
2.7.7 Phase Lock Loop (PLL) and Filter	32
2.7.8 BCLK[1:0] Specifications (CK505 based Platforms)	32
Table 18. Front Side Bus Differential BCLK Specifications	32
Figure 4. Differential Clock Waveform	33
Figure 5. Differential Clock Crosspoint Specification	33
Figure 6. Differential Measurements	33
2.7.9 BCLK[1:0] Specifications (CK410 based Platforms)	34
Table 19. Front Side Bus Differential BCLK Specifications	34
Figure 7. Differential Clock Crosspoint Specification	34
2.8 PECI DC Specifications	35
Table 20. PECI DC Electrical Limits	35
3 Package Mechanical Specifications	37
Figure 8. Processor Package Assembly Sketch	37
3.1 Package Mechanical Drawing	37
Figure 9. Processor Package Drawing Sheet 1 of 3	38
Figure 10. Processor Package Drawing Sheet 2 of 3	39
Figure 11. Processor Package Drawing Sheet 3 of 3	40
3.1.1 Processor Component Keep-Out Zones	41
3.1.2 Package Loading Specifications	41
Table 21. Processor Loading Specifications	41
3.1.3 Package Handling Guidelines	41
Table 22. Package Handling Guidelines	41
3.1.4 Package Insertion Specifications	42
3.1.5 Processor Mass Specification	42
3.1.6 Processor Materials	42
Table 23. Processor Materials	42
3.1.7 Processor Markings	42
Figure 12. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache with 1333 MHz FSB	42
Figure 13. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 4 MB L2 Cache with 1066 MHz FSB	43
Figure 14. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Sequence with 2 MB L2 Cache	43
Figure 15. Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E4000 Sequence with 2 MB L2 Cache	44
Figure 16. Processor Top-Side Markings for the Intel® Core™2 Extreme Processor X6800	44
3.1.8 Processor Land Coordinates	45
Figure 17. Processor Land Coordinates and Quadrants (Top View)	45
4 Land Listing and Signal Descriptions	47
4.1 Processor Land Assignments	47
Figure 18. land-out Diagram (Top View - Left Side)	48
Figure 19. land-out Diagram (Top View - Right Side)	49
Table 24. Alphabetical Land Assignments	50
Table 25. Numerical Land Assignment	60
4.2 Alphabetical Signals Reference	70
Table 26. Signal Description (Sheet 1 of 9)	70
5 Thermal Specifications and Design Considerations	79
5.1 Processor Thermal Specifications	79
5.1.1 Thermal Specifications	79
Table 27. Processor Thermal Specifications	80
Table 28. Thermal Profile (Intel® Core™2 Duo Desktop Processor E6x50 Sequence and E6540 with 4 MB L2 Cache)	81
Figure 20. Thermal Profile (Intel® Core™2 Duo Desktop Processor E6x50 Sequence and E6540 with 4 MB L2 Cache)	81
Table 29. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache)	82
Figure 21. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 Sequence with 4 MB L2 Cache)	82
Table 30. Thermal Profile (Intel® Core™2 Duo Desktop Processor E4500 and E4600 with 2 MB L2 Cache)	83
Figure 22. Thermal Profile (Intel® Core™2 Duo Desktop Processor E4500 and E4600 with 2 MB L2 Cache)	83
Table 31. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 and E4000 Sequence with 2 MB L2 Cache)	84
Figure 23. Thermal Profile (Intel® Core™ Duo Desktop Processor E6000 and E4000 Sequence with 2 MB L2 Cache)	84
Table 32. Thermal Profile (Intel® Core™2 Extreme Processor X6800)	85
Figure 24. Thermal Profile (Intel® Core™2 Extreme Processor X6800)	85
5.1.2 Thermal Metrology	86
Figure 25. Case Temperature (TC) Measurement Location	86
5.2 Processor Thermal Features	86
5.2.1 Thermal Monitor	86
5.2.2 Thermal Monitor 2	87
Figure 26. Thermal Monitor 2 Frequency and Voltage Ordering	88
5.2.3 On-Demand Mode	88
5.2.4 PROCHOT# Signal	89
5.2.5 THERMTRIP# Signal	89
5.3 Thermal Diode	90
Table 33. Thermal “Diode” Parameters using Diode Model	90
Table 34. Thermal “Diode” Parameters using Transistor Model	91
Table 35. Thermal Diode Interface	91
5.4 Platform Environment Control Interface (PECI)	92
5.4.1 Introduction	92
Figure 27. Processor PECI Topology	92
5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management	92
Figure 28. Conceptual Fan Control on PECI-Based Platforms	93
Figure 29. Conceptual Fan Control on Thermal Diode-Based Platforms	93
5.4.2 PECI Specifications	94
5.4.2.1 PECI Device Address	94
5.4.2.2 PECI Command Support	94
5.4.2.3 PECI Fault Handling Requirements	94
5.4.2.4 PECI GetTemp0() Error Code Support	94
Table 36. GetTemp0() Error Codes	94
6 Features	95
6.1 Power-On Configuration Options	95
Table 37. Power-On Configuration Option Signals	95
6.2 Clock Control and Low Power States	95
Figure 30. Processor Low Power State Machine	96
6.2.1 Normal State	96
6.2.2 HALT and Extended HALT Powerdown States	96
6.2.2.1 HALT Powerdown State	96
6.2.2.2 Extended HALT Powerdown State	97
6.2.3 Stop Grant and Extended Stop Grant States	97
6.2.3.1 Stop Grant State	97
6.2.3.2 Extended Stop Grant State	98
6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	98
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	98
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	98
6.3 Enhanced Intel® SpeedStep® Technology	98
7 Boxed Processor Specifications	101
Figure 31. Mechanical Representation of the Boxed Processor	101
7.1 Mechanical Specifications	102
7.1.1 Boxed Processor Cooling Solution Dimensions	102
Figure 32. Space Requirements for the Boxed Processor (Side View)	102
Figure 33. Space Requirements for the Boxed Processor (Top View)	102
Figure 34. Space Requirements for the Boxed Processor (Overall View)	103
7.1.2 Boxed Processor Fan Heatsink Weight	103
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	103
7.2 Electrical Requirements	103
7.2.1 Fan Heatsink Power Supply	103
Figure 35. Boxed Processor Fan Heatsink Power Cable Connector Description	104
Table 38. Fan Heatsink Power and Signal Specifications	104
Figure 36. Baseboard Power Header Placement Relative to Processor Socket	105
7.3 Thermal Specifications	105
7.3.1 Boxed Processor Cooling Requirements	105
Figure 37. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)	106
Figure 38. Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)	106
7.3.2 Fan Speed Control Operation (Intel® Core2 Extreme Processor X6800 Only)	107
7.3.3 Fan Speed Control Operation (Intel® Core2 Duo Desktop Processor E6000 and E4000 Sequences Only)	107
Figure 39. Boxed Processor Fan Heatsink Set Points	108
Table 39. Fan Heatsink Power and Signal Specifications	108
8 Balanced Technology Extended (BTX) Boxed Processor Specifications	111
Figure 40. Mechanical Representation of the Boxed Processor with a Type I TMA	111
Figure 41. Mechanical Representation of the Boxed Processor with a Type II TMA	112
8.1 Mechanical Specifications	112
8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions	112
Figure 42. Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes	113
Figure 43. Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume	114
8.1.2 Boxed Processor Thermal Module Assembly Weight	114
8.1.3 Boxed Processor Support and Retention Module (SRM)	115
Figure 44. Assembly Stack Including the Support and Retention Module	115
8.2 Electrical Requirements	116
8.2.1 Thermal Module Assembly Power Supply	116
Figure 45. Boxed Processor TMA Power Cable Connector Description	116
Table 40. TMA Power and Signal Specifications	117
Figure 46. Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area)	117
8.3 Thermal Specifications	118
8.3.1 Boxed Processor Cooling Requirements	118
8.3.2 Variable Speed Fan	118
Figure 47. Boxed Processor TMA Set Points	119
Table 41. TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors	119
9 Debug Tools Specifications	121
9.1 Logic Analyzer Interface (LAI)	121
9.1.1 Mechanical Considerations	121

Match case Limit results 1 per page

Balanced Technology Extended (BTX) Boxed Processor Specifications

116

Datasheet

8.2

Electrical Requirements

8.2.1

Thermal Module Assembly Power Supply

The boxed processor's Thermal Module Assembly (TMA) requires a +12 V power supply.

The TMA will include power cable to power the integrated fan and will plug into the 4-

wire fan header on the baseboard. The power cable connector and pinout are shown in

Figure 45

. Baseboards must provide a compatible power header to support the boxed

processor.

Table 40

contains specifications for the input and output signals at the TMA.

The TMA outputs a SENSE signal, which is an open-collector output that pulses at a rate

of 2 pulses per fan revolution. A baseboard pull-up resistor provides V

to match the

system board-mounted fan speed monitor requirements, if applicable. Use of the

SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should

be tied to GND.

The TMA receives a Pulse Width Modulation (PWM) signal from the motherboard from

the 4

pin of the connector labeled as CONTROL.

Note:

The boxed processor’s TMA requires a constant +12 V supplied to pin 2 and does not

support variable voltage control or 3-pin PWM control.

The power header on the baseboard must be positioned to allow the TMA power cable

to reach it. The power header identification and location should be documented in the

platform documentation, or on the system board itself.

Figure 46

shows the location of

the fan power connector relative to the processor socket. The baseboard power header

should be positioned within 4.33 inches from the center of the processor socket.

Figure 45.

Boxed Processor TMA Power Cable Connector Description

C bl

Signal

GND

+12 V

SENSE

CONTROL

Straight square pin, 4-pin terminal housing with

polarizing ribs and friction locking ramp.

0.100" pitch, 0.025" square pin width.

Match with straight pin, friction lock header on

mainboard.