Intel E6420 Data Sheet - Page 12
Terminology - dual core
UPC - 735858192569
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Introduction 1.1 1.1.1 Terminology A '#' symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the '#' symbol implies that the signal is inverted. For example, D[3:0] = 'HLHL' refers to a hex 'A', and D[3:0]# = 'LHLH' also refers to a hex 'A' (H= High logic level, L= Low logic level). The phrase "Front Side Bus" refers to the interface between the processor and system core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O. Processor Terminology Commonly used terms are explained here for clarification: • Intel® Core™2 Extreme processor X6800 - Dual core processor in the FCLGA6 package with a 4 MB L2 cache. • Intel® Core™2 Duo desktop processor E6850, E6750, E6550, E6540, E6700, E6600, E6420, and E6320, - Dual core processor in the FC-LGA6 package with a 4 MB L2 cache. • Intel® Core™2 Duo desktop processor E6400, E6300, E4600, E4500, E4400, and E4300- Dual core processor in the FC-LGA6 package with a 2 MB L2 cache. • Processor - For this document, the term processor is the generic form of the Intel® Core™2 Duo desktop processor E6000 and E4000 sequence and the Intel® Core™2 Extreme processor X6800. The processor is a single package that contains one or more execution units. • Keep-out zone - The area on or near the processor that system design can not use. • Processor core - Processor core die with integrated L2 cache. • LGA775 socket - The processors mate with the system board through a surface mount, 775-land, LGA socket. • Integrated heat spreader (IHS) -A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. • Retention mechanism (RM) - Since the LGA775 socket does not include any mechanical features for heatsink attach, a retention mechanism is required. Component thermal solutions should attach to the processor via a retention mechanism that is independent of the socket. • FSB (Front Side Bus) - The electrical interface that connects the processor to the chipset. Also referred to as the processor system bus or the system bus. All memory and I/O transactions as well as interrupt messages pass between the processor and chipset over the FSB. • Storage conditions - Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased, or receive any clocks. Upon exposure to "free air"(i.e., unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. 12 Datasheet