Intel E6700 Mechanical Design Guidelines - Page 11
References, Definition of Terms - lga775
UPC - 735858184618
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Introduction 1.2 1.3 References Material and concepts available in the following documents may be beneficial when reading this document. Material and concepts available in the following documents may be beneficial when reading this document. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire PWM Controlled Fans ATX Thermal Design Suggestions microATX Thermal Design Suggestions Balanced Technology Extended (BTX) System Design Guide Thermally Advantaged Chassis Design Guide Location www.intel.com/design/processor/d atashts/318732.htm http://download.intel.com/design/ processor/datashts/320467.pdf http://download.intel.com/design/ processor/datashts/322567.pdf http://developer.intel.com/design/ Pentium4/guides/302666.htm http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.intel.com/go/chassis/ Definition of Terms Term T A TC TE T S TC-MAX ΨCA Description The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The case temperature of the processor, measured at the geometric center of the topside of the IHS. The ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. Heatsink temperature measured on the underside of the heatsink base, at a location corresponding to TC. The maximum case temperature as specified in a component specification. Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. This is defined as: (TC - TA) / Total Package Power. Note: Heat source must be specified for Ψ measurements. Thermal and Mechanical Design Guidelines 11