Intel E6700 Mechanical Design Guidelines - Page 92
Position Bead on the Groove Step, Detailed Thermocouple Bead Placement
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Case Temperature Reference Metrology 11. While still at the microscope, press the wire down about 6mm [0.125"] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 7-20). Refer to Figure 7-21 for detailed bead placement. Figure 7-20. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 7-21. Detailed Thermocouple Bead Placement TC Wire with Insulation IHS with Groove TC Bead 92 Thermal and Mechanical Design Guidelines
![](/manual_guide/products/intel-e6700-mechanical-design-guidelines-0b4f3dd/92.png)
Case Temperature Reference Metrology
92
Thermal and Mechanical Design Guidelines
11.
While still at the microscope, press the wire down about 6mm [0.125”] from the
thermocouple bead using the tweezers or your finger. Place a piece of Kapton*
tape to hold the wire inside the groove (Figure 7-20). Refer to Figure 7-21 for
detailed bead placement.
Figure 7-20. Position Bead on the Groove Step
Figure 7-21. Detailed Thermocouple Bead Placement
TC Wire with Insulation
IHS with Groove
TC Bead
Wire section
into the
groove to
prepare for
final bead
placement
Kapton*
tape