Intel E8200 Data Sheet - Page 10

Introduction

10

Datasheet

1.1

Terminology

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in

the active state when driven to a low level. For example, when RESET# is low, a reset

has been requested. Conversely, when NMI is high, a nonmaskable interrupt has

occurred. In the case of signals where the name does not imply an active state but

describes part of a binary sequence (such as

address

or

data

), the ‘#’ symbol implies

that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and

D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

“Front Side Bus” refers to the interface between the processor and system core logic

(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,

memory, and I/O.

1.1.1

Processor Terminology Definitions

Commonly used terms are explained here for clarification:

•

Intel

®

Core™2 Duo processor E8000 series

— Dual core processor in the FC-

LGA8 package with a 6 MB L2 cache.

•

Intel

®

Core™2 Duo processor E7000 series

— Dual core processor in the FC-

LGA8 package with a 3 MB L2 cache.

•

Processor

— For this document, the term processor is the generic form of the

Intel

®

Core™2 Duo processor E8000 series and Intel

®

Core™2 Duo processor

E7000 series.

•

Voltage Regulator Design Guide

— For this document “Voltage Regulator Design

Guide” may be used in place of:

—

Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design

Guidelines For Desktop LGA775 Socket

•

Enhanced Intel

®

Core

™

microarchitecture

— A new foundation for Intel

®

architecture-based desktop, mobile and mainstream server multi-core processors.

For additional information refer to:

http://www.intel.com/technology/architecture/

coremicro/

•

Keep-out zone

— The area on or near the processor that system design can not

use.

•

Processor core

— Processor die with integrated L2 cache.

•

LGA775 socket

— The processors mate with the system board through a surface

mount, 775-land, LGA socket.

•

Integrated heat spreader (IHS)

—A component of the processor package used

to enhance the thermal performance of the package. Component thermal solutions

interface with the processor at the IHS surface.

•

Retention mechanism (RM)

— Since the LGA775 socket does not include any

mechanical features for heatsink attach, a retention mechanism is required.

Component thermal solutions should attach to the processor using a retention

mechanism that is independent of the socket.

•

FSB (Front Side Bus)

— The electrical interface that connects the processor to

the chipset. Also referred to as the processor system bus or the system bus. All

memory and I/O transactions as well as interrupt messages pass between the

processor and chipset over the FSB.

Section	Page
1 Introduction	9
1.1 Terminology	10
1.1.1 Processor Terminology Definitions	10
1.2 References	12
2 Electrical Specifications	13
2.1 Power and Ground Lands	13
2.2 Decoupling Guidelines	13
2.2.1 VCC Decoupling	13
2.2.2 VTT Decoupling	13
2.2.3 FSB Decoupling	14
2.3 Voltage Identification	14
2.4 Reserved, Unused, and TESTHI Signals	16
2.5 Power Segment Identifier (PSID)	16
2.6 Voltage and Current Specification	17
2.6.1 Absolute Maximum and Minimum Ratings	17
2.6.2 DC Voltage and Current Specification	18
2.6.3 VCC Overshoot	23
2.6.4 Die Voltage Validation	24
2.7 Signaling Specifications	24
2.7.1 FSB Signal Groups	25
2.7.2 CMOS and Open Drain Signals	26
2.7.3 Processor DC Specifications	27
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications	29
2.7.3.2 GTL+ Front Side Bus Specifications	30
2.8 Clock Specifications	31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])	32
2.8.3 Phase Lock Loop (PLL) and Filter	32
2.8.4 BCLK[1:0] Specifications	32
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
3.9 Processor Land Coordinates	41
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	66
5 Thermal Specifications and Design Considerations	77
5.1 Processor Thermal Specifications	77
5.1.1 Thermal Specifications	77
5.1.2 Thermal Metrology	81
5.2 Processor Thermal Features	81
5.2.1 Thermal Monitor	81
5.2.2 Thermal Monitor 2	82
5.2.3 On-Demand Mode	83
5.2.4 PROCHOT# Signal	84
5.2.5 THERMTRIP# Signal	84
5.3 Platform Environment Control Interface (PECI)	85
5.3.1 Introduction	85
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems	85
5.3.2 PECI Specifications	86
5.3.2.1 PECI Device Address	86
5.3.2.2 PECI Command Support	86
5.3.2.3 PECI Fault Handling Requirements	86
5.3.2.4 PECI GetTemp0() Error Code Support	86
6 Features	87
6.1 Power-On Configuration Options	87
6.2 Clock Control and Low Power States	87
6.2.1 Normal State	88
6.2.2 HALT and Extended HALT Powerdown States	88
6.2.2.1 HALT Powerdown State	88
6.2.2.2 Extended HALT Powerdown State	89
6.2.3 Stop Grant and Extended Stop Grant States	89
6.2.3.1 Stop-Grant State	89
6.2.3.2 Extended Stop Grant State	90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	90
6.2.5 Sleep State	90
6.2.6 Deep Sleep State	91
6.2.7 Deeper Sleep State	91
6.2.8 Enhanced Intel SpeedStep® Technology	92
6.3 Processor Power Status Indicator (PSI) Signal	92
7 Boxed Processor Specifications	93
7.1 Introduction	93
7.2 Mechanical Specifications	94
7.2.1 Boxed Processor Cooling Solution Dimensions	94
7.2.2 Boxed Processor Fan Heatsink Weight	95
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	95
7.3 Electrical Requirements	95
7.3.1 Fan Heatsink Power Supply	95
7.4 Thermal Specifications	97
7.4.1 Boxed Processor Cooling Requirements	97
7.4.2 Variable Speed Fan	99
8 Debug Tools Specifications	101
8.1 Logic Analyzer Interface (LAI)	101
8.1.1 Mechanical Considerations	101

Intel E8200 Data Sheet - Page 10

Terminology - performance

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