Intel E8200 Data Sheet - Page 11

Datasheet

11

Introduction

•

Storage conditions

— Refers to a non-operational state. The processor may be

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor lands should not be

connected to any supply voltages, have any I/Os biased, or receive any clocks.

Upon exposure to “free air”(i.e., unsealed packaging or a device removed from

packaging material) the processor must be handled in accordance with moisture

sensitivity labeling (MSL) as indicated on the packaging material.

•

Functional operation

— Refers to normal operating conditions in which all

processor specifications, including DC, AC, system bus, signal quality, mechanical

and thermal are satisfied.

•

Execute Disable Bit

— Execute Disable Bit allows memory to be marked as

executable or non-executable, when combined with a supporting operating system.

If code attempts to run in non-executable memory the processor raises an error to

the operating system. This feature can prevent some classes of viruses or worms

that exploit buffer over run vulnerabilities and can thus help improve the overall

security of the system. See the Intel

®

Architecture Software Developer's Manual

for more detailed information.

•

Intel

®

64 Architecture

— An enhancement to Intel's IA-32 architecture, allowing

the processor to execute operating systems and applications written to take

advantage of the Intel 64 architecture. Further details on Intel 64 architecture and

programming model can be found in the Intel Extended Memory 64 Technology

Software Developer Guide at http://developer.intel.com/technology/

64bitextensions/.

•

Enhanced Intel SpeedStep

®

Technology

— Enhanced Intel SpeedStep

Technology allows trade-offs to be made between performance and power

consumptions, based on processor utilization. This may lower average power

consumption (in conjunction with OS support).

•

Intel

®

Virtualization Technology (Intel

®

VT)

— A set of hardware

enhancements to Intel server and client platforms that can improve virtualization

solutions. Intel VT will provide a foundation for widely-deployed virtualization

solutions and enables more robust hardware assisted virtualization solutions. More

information can be found at: http://www.intel.com/technology/virtualization/

•

Intel

®

Trusted Execution Technology (Intel

®

TXT)

— A key element in Intel's

safer computing initiative which defines a set of hardware enhancements that

interoperate with an Intel TXT enabled OS to help protect against software-based

attacks. Intel TXT creates a hardware foundation that builds on Intel's

Virtualization Technology (Intel VT) to help protect the confidentiality and integrity

of data stored/created on the client PC.

•

Platform Environment Control Interface (PECI)

— A proprietary one-wire bus

interface that provides a communication channel between the processor and

chipset components to external monitoring devices.

Section	Page
1 Introduction	9
1.1 Terminology	10
1.1.1 Processor Terminology Definitions	10
1.2 References	12
2 Electrical Specifications	13
2.1 Power and Ground Lands	13
2.2 Decoupling Guidelines	13
2.2.1 VCC Decoupling	13
2.2.2 VTT Decoupling	13
2.2.3 FSB Decoupling	14
2.3 Voltage Identification	14
2.4 Reserved, Unused, and TESTHI Signals	16
2.5 Power Segment Identifier (PSID)	16
2.6 Voltage and Current Specification	17
2.6.1 Absolute Maximum and Minimum Ratings	17
2.6.2 DC Voltage and Current Specification	18
2.6.3 VCC Overshoot	23
2.6.4 Die Voltage Validation	24
2.7 Signaling Specifications	24
2.7.1 FSB Signal Groups	25
2.7.2 CMOS and Open Drain Signals	26
2.7.3 Processor DC Specifications	27
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications	29
2.7.3.2 GTL+ Front Side Bus Specifications	30
2.8 Clock Specifications	31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])	32
2.8.3 Phase Lock Loop (PLL) and Filter	32
2.8.4 BCLK[1:0] Specifications	32
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
3.9 Processor Land Coordinates	41
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	66
5 Thermal Specifications and Design Considerations	77
5.1 Processor Thermal Specifications	77
5.1.1 Thermal Specifications	77
5.1.2 Thermal Metrology	81
5.2 Processor Thermal Features	81
5.2.1 Thermal Monitor	81
5.2.2 Thermal Monitor 2	82
5.2.3 On-Demand Mode	83
5.2.4 PROCHOT# Signal	84
5.2.5 THERMTRIP# Signal	84
5.3 Platform Environment Control Interface (PECI)	85
5.3.1 Introduction	85
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems	85
5.3.2 PECI Specifications	86
5.3.2.1 PECI Device Address	86
5.3.2.2 PECI Command Support	86
5.3.2.3 PECI Fault Handling Requirements	86
5.3.2.4 PECI GetTemp0() Error Code Support	86
6 Features	87
6.1 Power-On Configuration Options	87
6.2 Clock Control and Low Power States	87
6.2.1 Normal State	88
6.2.2 HALT and Extended HALT Powerdown States	88
6.2.2.1 HALT Powerdown State	88
6.2.2.2 Extended HALT Powerdown State	89
6.2.3 Stop Grant and Extended Stop Grant States	89
6.2.3.1 Stop-Grant State	89
6.2.3.2 Extended Stop Grant State	90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	90
6.2.5 Sleep State	90
6.2.6 Deep Sleep State	91
6.2.7 Deeper Sleep State	91
6.2.8 Enhanced Intel SpeedStep® Technology	92
6.3 Processor Power Status Indicator (PSI) Signal	92
7 Boxed Processor Specifications	93
7.1 Introduction	93
7.2 Mechanical Specifications	94
7.2.1 Boxed Processor Cooling Solution Dimensions	94
7.2.2 Boxed Processor Fan Heatsink Weight	95
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	95
7.3 Electrical Requirements	95
7.3.1 Fan Heatsink Power Supply	95
7.4 Thermal Specifications	97
7.4.1 Boxed Processor Cooling Requirements	97
7.4.2 Variable Speed Fan	99
8 Debug Tools Specifications	101
8.1 Logic Analyzer Interface (LAI)	101
8.1.1 Mechanical Considerations	101

Intel E8200 Data Sheet - Page 11

Platform Environment Control Interface PECI - virtualization

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