Intel Pga478 Data Sheet - Page 62

Intel

®

Celeron

®

Processor 1.66 GHz/1.83 GHz—Thermal Specifications and Design

Considerations

Intel

®

Celeron

®

Processor 1.66 GHz/1.83 GHz

DS

January 2007

62

Order Number: 315876-002

5.1

Thermal Specifications

The Intel

®

Celeron

®

Processor 1.66 GHz/1.83 GHz incorporates three methods of

monitoring die temperature, the Digital Thermal Sensor, Intel Thermal Monitor and the

Thermal Diode. The Intel Thermal Monitor (detailed in

Section 5.1.3

) must be used to

determine when the maximum specified processor junction temperature has been

reached.

5.1.1

Thermal Diode

The processor incorporates an on-die PNP transistor whose base emitter junction is

used as a thermal “diode”, with its collector shorted to ground. The thermal diode, can

be read by an off-die analog/digital converter (a thermal sensor) located on the

motherboard, or a stand-alone measurement kit. The thermal diode may be used to

monitor the die temperature of the processor for thermal management or

instrumentation purposes but is not a reliable indication that the maximum operating

temperature of the processor has been reached. When using the thermal diode, a

temperature offset value must be read from a processor Model Specific Register (MSR)

and applied. Refer to

Section 5.1.2

for more details. Please refer to

Section 5.1.3

for

thermal diode usage recommendation when the PROCHOT# signal is not asserted.

Note:

The reading of the external thermal sensor (on the motherboard) connected to the

processor thermal diode signals, does not necessarily reflect the temperature of the

hottest location on the die. This is due to inaccuracies in the external thermal sensor,

on-die temperature gradients between the location of the thermal diode and the hottest

location on the die, and time based variations in the die temperature measurement.

Time based variations can occur when the sampling rate of the thermal diode (by the

thermal sensor) is slower than the rate at which the T

J

temperature can change.

Offset between the thermal diode based temperature reading and the Intel Thermal

Monitor reading may be characterized using the Intel Thermal Monitor’s Automatic

mode activation of thermal control circuit. This temperature offset must be taken into

account when using the processor thermal diode to implement power management

events. This offset is different than the diode T

offset

value programmed into the Intel

®

Celeron

®

Processor 1.66 GHz/1.83 GHz Model Specific Register (MSR).

Table 17

,

Table 18

, and

Table 19

provide the “diode” interface and specifications. Two

different sets of “diode” parameters are listed in

Table 18

. The Diode Model parameters

(

Table 18

) apply to traditional thermal sensors that use the Diode Equation to

determine the processor temperature. Transistor Model parameters (

Table 19

) have

been added to support thermal sensors that use the transistor equation method. The

P

SLP

Sleep Power

14.8

W

2

T

J

Junction Temperature

0

100

°

C

3

Notes:

1.

The TDP specification should be used to design the processor thermal solution.

The TDP is not the maximum theoretical power the processor can generate.

2.

Not 100% tested. These power specifications are determined by characterization

of the processor currents at higher temperatures and extrapolating to 50 C.

3.

As measured by the activation of the on-die Intel Thermal Monitor. The Intel

Thermal Monitor’s automatic mode is used to indicate that the maximum T

J

has

been reached. Refer to

Section 5.1

for more details.

4.

The Intel Thermal Monitor automatic mode must be enabled for the processor to

operate within specifications.

Table 16.

Power Specifications for the Intel

®

Celeron

®

Processor 1.66 GHz/1.83 GHz

(Sheet 2 of 2)

Symbol

Core Frequency & Voltage

Thermal Design

Power

Unit

Notes

Section	Page
Intel® Celeron® Processor 1.66 GHz/ 1.83 GHz	1
Contents	3
Figures	3
Tables	3
Revision History	5
1.0 Introduction	6
Note: The term AGTL+ is used to refer to Assisted GTL+ signaling technology on the processor.	7
1.1 Terminology	7
Table 1. Terminology (Sheet 1 of 2)	7
1.2 References	8
Table 2. References	8
1.3 State of Data	9
Note: All references to the Intel® Celeron® Processor 1.66 GHz/1.83 GHz in this document apply to the Intel® Celeron® Processor 1.66 GHz/1.83 GHz only, unless otherwise specified.	9
2.0 Low Power Features	10
2.1 Clock Control and Low Power States	10
Figure 1. Package-Level Low Power States	10
Figure 2. Core Low Power States	11
2.1.1 Core Low Power States	11
2.1.1.1 C0 State - Normal State	11
2.1.1.2 C1/AutoHALT Powerdown State	11
2.1.1.3 C1/MWAIT Powerdown State	12
2.1.2 Package Low Power States	12
2.1.2.1 Normal State	12
2.1.2.2 Stop-Grant State	12
2.1.2.3 Stop Grant Snoop State	13
2.1.2.4 Sleep State	13
2.2 Enhanced Intel® SpeedStep® Technology (EIST)	13
2.3 Extended Halt State (C1E)	13
Note: The Extended HALT (C1E) state must be enabled for the processor to remain within its specifications.	13
3.0 Electrical Specifications	15
3.1 Front Side Bus and GTLREF	15
3.2 Power and Ground Pins	15
3.3 Decoupling Guidelines	15
3.3.1 VCC Decoupling	15
3.3.2 FSB AGTL+ Decoupling	16
3.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking	16
3.4 Voltage Identification and Power Sequencing	16
Table 3. Intel® Celeron® Processor 1.66 GHz/1.83 GHz VID Map (Sheet 1 of 3)	16
3.5 Catastrophic Thermal Protection	18
3.6 Signal Terminations and Unused Pins	18
Note: The TEST1 and TEST2 pins have unique signal termination requirements. It is mandatory that the TEST2 pin have a 51 W +/-5% pull down resistor to Vss. Please refer to Table 11 for details.	18
3.7 FSB Frequency Select Signals (BSEL[2:0])	18
Table 4. BSEL[2:0] Encoding for BCLK Frequency	18
3.8 FSB Signal Groups	19
Table 5. FSB Pin Groups	19
3.9 CMOS Signals	20
3.10 Maximum Ratings	20
Table 6. Processor DC Absolute Maximum Ratings	20
3.11 Processor DC Specifications	20
Note: The processor DC specifications in this section are defined at the processor core (pads) unless noted otherwise.	20
Table 7. Voltage and Current Specifications for the Intel® Celeron® Processor 1.66 GHz/1.83 GHz	21
Figure 3. Active VCC and ICC Load Line for Intel® Celeron® Processor 1.66 GHz/1.83 GHz	22
Table 8. AGTL+ Signal Group DC Specifications (Sheet 1 of 2)	22
Table 9. CMOS Signal Group DC Specifications	23
Table 10. Open Drain Signal Group DC Specifications	24
4.0 Package Mechanical Specifications and Pin Information	25
4.1 Package Mechanical Specifications	25
4.1.1 Package Mechanical Drawings	25
Figure 4. Micro-FCPGA Package Top and Bottom Views	25
Figure 5. Micro-FCPGA Processor Package Drawing (Sheet 1)	26
Figure 6. Micro-FCPGA Processor Package Drawing (Sheet 2)	27
4.1.2 Processor Component Keep-Out Zones	27
4.1.3 Package Loading Specifications	28
4.1.4 Processor Mass Specifications	28
4.2 Processor Pin-Out and Pin List	28
Figure 7. The Coordinates of the Processor Pins as Viewed From the Top of the Package	29
4.2.1 Alphabetical Signals Reference	30
Table 11. Signal Description (Sheet 1 of 7)	30
Table 12. Quad-Pumped Signal Groups	32
Table 13. DINV[3:0]# Assignment To Data Bus	32
Table 14. Alphabetical Signal Listing (Sheet 1 of 12)	37
Table 15. Alphabetical Pin Listing (Sheet 1 of 12)	49
5.0 Thermal Specifications and Design Considerations	61
Table 16. Power Specifications for the Intel® Celeron® Processor 1.66 GHz/1.83 GHz (Sheet 1 of 2)	61
5.1 Thermal Specifications	62
5.1.1 Thermal Diode	62
Note: The reading of the external thermal sensor (on the motherboard) connected to the processor thermal diode signals, does not...	62
Table 17. Thermal Diode Interface	63
Table 18. Thermal “Diode” Parameters using Diode Mode	63
5.1.2 Thermal Diode Offset	64
Table 19. Thermal “Diode” ntrim and Diode Correction Toffset	64
5.1.3 Intel® Thermal Monitor	64
Note: The Intel thermal monitor automatic mode must be enabled through BIOS for the processor to be operating within specifications.	64
Note: Intel recommends both Thermal Monitor 1 (TM1) and Thermal Monitor 2 (TM2) be always enabled on Intel® Celeron® Processor 1.66 GHz/1.83 GHz.	64
Note: The Intel® Celeron® Processor 1.66 GHz/1.83 GHz only supports TM2 initiated voltage/ frequency transitions. Intel® Celeron...	65
Note: PROCHOT# is not asserted when the processor is in the Stop Grant, and Sleep, low power states (internal clocks stopped), h...	65
5.1.4 Digital Thermal Sensor	66
5.1.5 Out of Specification Detection	66
5.1.6 PROCHOT# Signal Pin	66
5.1.7 FORCEPR# Signal Pin	67

Intel Pga478 Data Sheet - Page 62

Thermal Specifications

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