Intel R2000GZ R2000GZ and R2000GL - Page 11

Intel

®

Server System R2000GZ/GL Product Family TPS

Revision 2.0

1

1.

Introduction

This Technical Product Specification (TPS) provides system level information for the Intel

®

Server System

R2000GZ and Intel

®

Server System R2000GL product families. The system level features of both these

product families are common, however the server board integrated into them is different. The Intel

®

Server

System R2000GZ product family is integrated with an Intel

®

Server Board S2600GZ and the Intel

®

Server

System R2000GL product family is integrated with the Intel

®

Server Board S2600GL.

This document will describe the functions and features of the integrated server system which includes the

chassis layout, system boards, power sub-system, cooling sub-system, storage sub-system options, and

available installable options. Server board specific detail can be obtained by referencing the

Intel

®

Server

Board S2600GZ/S26000GLTechnical Product Specification

.

In addition, design-level information related to specific server board components / subsystems can be obtained

by ordering External Product Specifications (EPS) or External Design Specifications (EDS) related to this

server generation. EPS and EDS documents are made available under NDA with Intel and must be ordered

through your local Intel

representative. See the Reference Documents

section at the end of this document for a

list of available documents.

1.1

Chapter Outline

This document is divided into the following chapters:



Chapter 1 – Introduction



Chapter 2 – Product Family Overview



Chapter 3 – Power Subsystem



Chapter 4 – Thermal Management



Chapter 5 – Intel

®

Xeon Phi™ Coprocessor card and GPGPU add-in card support



Chapter 6 – System Storage and Peripherals Drive Bay Overview



Chapter 7 – Storage Controller Options Overview



Chapter 8 – Front Control Panel and I/O Panel Overview



Chapter 9 – Intel

®

Local Control Panel



Chapter 10 – PCI Riser Card Support



Chapter 11 – Mezzanine Module Support



Appendix A – Integration and Usage Tips



Appendix B – POST Code Diagnostic LED Decoder



Appendix C – Post Code Errors



Appendix D – System Configuration Table for Thermal Compatibility



Glossary



Reference Documents

1.2

Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and

power delivery components that need adequate airflow to cool. Intel

®

ensures through its own chassis

development and testing that when Intel

®

server building blocks are used together, the fully integrated system

will meet the intended thermal requirements of these components. It is the responsibility of the system

integrator who chooses not to use Intel

®

-developed server building blocks to consult vendor datasheets and

operating parameters to determine the amount of airflow required for their specific application and

environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board

does not operate correctly when used outside any of their published operating or

non-operating limits.

Section	Page
1. Introduction	11
1.1 Chapter Outline	11
1.2 Server Board Use Disclaimer	11
1.3 Product Errata	12
2. Product Family Overview	13
2.1 Chassis Dimensions	16
2.2 System Level Environmental Limits	17
2.3 System Features and Options Overview	18
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options	18
2.3.2 Back Panel Features	20
2.3.3 Front Control Panel Options	20
2.4 Server Board Features Overview	21
2.5 Available Front Bezel Support	23
2.6 Available Rack and Cabinet Mounting Kit Options	25
3. Power Subsystem	26
3.1 Mechanical Overview	26
3.2 Power Connectors	28
3.2.1 Power Supply Module Card Edge Connector	28
3.2.2 Riser Card Power Connectors	28
3.2.3 Hot Swap Backplane Power Connector	29
3.2.4 Optical Drive and SSD Power Connector	29
3.3 Power Supply Module Efficiency	30
3.4 Power Cord Specification Requirements	30
3.5 Optional Chassis Grounding Support	30
3.6 AC Power Supply Input Specifications	31
3.6.1 Power Factor	31
3.6.2 AC Input Voltage Specification	31
3.6.3 AC Line Isolation Requirements	31
3.6.4 AC Line Dropout / Holdup	31
3.6.4.1 AC Line 12VSBHoldup	32
3.6.5 AC Line Fuse	32
3.6.6 AC Inrush	32
3.6.7 AC Line Transient Specification	32
3.6.8 Susceptibility Requirements	32
3.6.9 Electrostatic Discharge Susceptibility	33
3.6.10 Fast Transient/Burst	33
3.6.11 Radiated Immunity	33
3.6.12 Surge Immunity	33
3.6.13 Power Recovery	33
3.6.14 Voltage Interruptions	33
3.6.15 Protection Circuits	33
3.6.15.1 Over-current Protection (OCP)	33
3.6.15.2 Over-voltage Protection (OVP)	34
3.6.15.3 Over-temperature Protection (OTP)	34
3.7 Cold Redundancy Support	34
3.7.1 Powering on Cold Standby supplies to maintain best efficiency	35
3.7.2 Powering on Cold Standby supplies during a fault or over current condition	35
3.7.3 BMC Requirements	35
3.7.4 Power Supply Turn On Function	35
3.8 Closed Loop System Throttling (CLST)	36
3.9 Smart Ride Through (SmaRT)	36
3.10 Power Supply Status LED	36
4. Thermal Management	37
4.1 Thermal Operation and Configuration Requirements	37
4.2 Thermal Management Overview	38
4.2.1 Set Throttling Mode	39
4.2.2 Altitude	39
4.2.3 Set Fan Profile	39
4.2.4 Fan PWM Offset	39
4.2.5 Quiet Fan Idle Mode	39
4.2.6 Thermal Sensor Input for Fan Speed Control	39
4.3 System Fans	40
4.4 Power Supply Module Fan	43
4.5 FRUSDR Utility	43
5. Intel® Xeon Phi™ Coprocessor and GPGPU Add-in Card Support	44
5.1 Using High Power Add-in Cards with Active Cooling Solutions	44
5.2 Using High Power Add-in Cards with Passive Cooling Solutions	45
5.3 Intel® Xeon Phi™ Coprocessor Card – System Configuration Requirements	46
5.4	46
6. System Storage and Peripheral Drive Bays Overview	47
6.1 2.5” Hard Disk Drive Support	47
6.1.1 2.5” Drive Hot-Swap Backplane Overview	49
6.1.2 Cypress* CY8C22545 Enclosure Management Controller	50
6.2 3.5” Hard Disk Drive Support	51
6.2.1 3.5” Drive Hot-Swap Backplane Overview	52
6.2.2 Cypress* CY8C22545 Enclosure Management Controller	53
6.3 Optical Drive Support	54
6.4 Internal – Fixed Mount Solid State Drive (SSD) Support	55
6.5 Low Profile eUSB SSD Support	56
6.6 SATA DOM Support	56
7. Storage Controller Options Overview	57
7.1 Embedded SATA / SAS Controller support	57
7.2 Embedded Software RAID Support	58
7.2.1 Intel® Embedded Server RAID Technology 2 (ESRT2)	58
7.2.2 Intel® Rapid Storage Technology (RSTe)	58
7.3 Intel® Integrated RAID Module Support (Available Option)	59
7.4 Intel® SAS Expander Support	60
7.4.1 24-Port PCIe Intel® RAID Expander Card RES2SV240	61
7.4.2 24-Port and 36-Port Internal Intel RAID Expander Cards	61
7.4.3 SAS Expander Usage Guidelines	63
7.4.4 Sample SAS Expander Configurations	63
7.4.4.1 Cable Routing using the both embedded SCU ports and a SAS Expander Card (RSTe only)	64
7.4.4.2 Cable Routing using a x8 wide-port capable 6 Gb SAS / SAS RAID Controller and an expander card	64
8. Front Control Panel and I/O Panel Overview	65
8.1 I/O Panel Features	65
8.2 Control Panel Features	65
9. Intel® Local Control Panel	69
10. PCI Riser Card Support	70
10.1 Riser Slot Overview	70
10.2 Riser Card Assembly	72
10.3 Riser Card Options	73
10.3.1 3-Slot PCIe Riser Card	73
10.3.2 2-Slot PCIe Riser Card	74
10.3.3 3-Slot PCIx / PCIe Riser Card	74
11. Mezzanine Module Support	75
11.1 IO Module Support	75
11.2 Intel® Remote Management Module 4 (RMM4) Lite and Management NIC Support	75
Appendix A: Integration and Usage Tips	77
Appendix B: POST Code Diagnostic LED Decoder	78
Appendix C: POST Code Errors	83
Appendix D: System Configuration Table for Thermal Compatibility	88
Glossary	91

Intel R2000GZ R2000GZ and R2000GL - Page 11

Introduction, 1.1 Outline, 1.2 Server Board Use Disclaimer

Page 11 highlights