Intel S5000XVNSATA Product Specification - Page 24

Intel® Workstation Board S5000XVN TPS Functional Architecture Processor Family Intel® Xeon® Processor 5148 Intel® Xeon® Processor 5150 Intel® Xeon® Processor 5160 Intel® Xeon® Processor E5310 Intel® Xeon® Processor E5320 Intel® Xeon® Processor E5335 Intel® Xeon® Processor E5345 Intel® Xeon® Processor X5355 System Bus Speed 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz Core Frequency 2.33 GHz 2.66 GHz 3.00 GHz 1.6 GHz 1.86 GHz 2.00 GHz 2.33 GHz 2.66 GHz Cache 4 MB 4 MB 4 MB 8 MB 8 MB 8 MB 8 MB 8 MB Watts Support 40 Yes 65 Yes 80 Yes 80 Yes 80 Yes 80 Yes 80 Yes 120 Yes 3.1.2.1 Processor Population Rules When two processors are installed, both must be of identical revision, core voltage, and bus/core speed. When only one processor is installed, it must be in the socket labeled CPU1. The other socket must be empty. The board is designed to provide up to 130 A of current per processor. This board does not support processors with higher current requirements. No terminator is required in the second processor socket when using a single processor configuration. 3.1.2.2 Common Enabling Kit (CEK) Design Support The workstation board complies with Intel's Common Enabling Kit (CEK) processor mounting and heatsink retention solution. The workstation board ships with a CEK spring snapped onto the underside of the workstation board beneath each processor socket. The heatsink attaches to the CEK over the top of the processor and the thermal interface material (TIM). Refer to the following figure for the stacking order of the chassis, CEK spring, workstation board, TIM, and heatsink. The CEK spring is removable, which allows for the use of non-Intel heatsink retention solutions. Note: The processor heatsink and CEK spring shown in the following diagram are for reference purposes only. The actual processor heatsink and CEK solutions compatible with this generation server board may be of a different design. Revision 1.5 15 Intel order number: D66403-006