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Power Supply Output Requirements - motherboard

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Intel® Workstation Board S5000XVN TPS Design and Environmental Specifications 8.3.1 Processor Power Support The workstation board supports the Thermal Design Point (TDP) guideline for Intel® Xeon® processors. The Flexible Motherboard Guidelines (FMB) also were followed to help determine the suggested thermal and current design values for anticipating future processor needs. The following table provides maximum values for Icc, TDP power, and TCASE for the Intel® Xeon® processor 5000 sequence family: Table 37. Intel® Xeon® Processor Dual Processor TDP Guidelines TDP Power 130 W Max TCASE 70º C Icc MAX 150 A Note: These values are for reference only. The Intel® Xeon®) processor 5000 sequence Datasheet contains the actual specifications for the processor. If the values found in the Intel(r) Xeon® processor 5000 sequence Datasheet are different than those published here, the DualCore Intel®Xeon® processor 5000 sequence Datasheet values will supersede these, and should be used. 8.4 Power Supply Output Requirements This section is for reference purposes only. The intent is to provide guidance to system designers to determine a power supply for use with this server board. This section specifies the power supply requirements Intel used to develop a power supply for its workstation system. The combined power of all outputs shall not exceed the rated output power of the power supply. The power supply must meet both static and dynamic voltage regulation requirements for the minimum loading conditions. Table 38. 550 W Load Ratings Voltage Minimum Continuous Maximum Continuous Peak +3.3 V +5 V +12 V1 +12 V2 +12 V3 +12 V4 -12 V +5 VSB 1.5 A 1.0 A 0.5 A 0.5 A 0.5 A 0.5 A 0 A 0.1 A 24 A 24 A 16 A 16 A 14 A 8 A 0.5 A 3.0 A 18 A 18 A 13 A 3.5 A Note: 1. Maximum continuous total DC output power should not exceed 550 W. 2. Maximum continuous combined load on +3.3 VDC and +5 VDC outputs shall not exceed 140 W. 3. Maximum peak total DC output power should not exceed 660 W. 4. Peak power and current loading shall be supported for a minimum of 12 seconds. 5. Maximum combined current for the 12 V outputs shall be 41 A. 6. Peak current for the combined 12 V outputs shall be 50 A. Revision 1.5 59 Intel order number: D66403-006

Section	Page
1. Introduction	10
1.1 Chapter Outline	10
1.2 Server Board Use Disclaimer	10
2. Overview	11
2.1 Workstation Board Feature Set	11
2.2 Workstation Board Layout	12
2.2.1 Workstation Board Connector and Component Layout	13
2.2.2 Workstation Board Mechanical Drawings	15
2.2.3 Workstation Board ATX I/O Layout	21
3. Functional Architecture	22
3.1 Intel® 5000X Memory Controller Hub (MCH)	23
3.1.1 System Bus Interface	23
3.1.2 Processor Support	23
3.1.2.1 Processor Population Rules	24
3.1.2.2 Common Enabling Kit (CEK) Design Support	24
3.1.3 Memory Subsystem	25
3.1.3.1 Memory RASUM Features	27
3.1.3.2 Supported Memory	27
3.1.3.3 DIMM Population Rules and Supported DIMM Configurations	28
3.1.3.3.1 Minimum Non-Mirrored Mode Configuration	30
3.1.3.4 Non-mirrored Mode Memory Upgrades	30
3.1.3.4.1 Mirrored Mode Memory Configuration	31
3.1.3.4.2 Sparing Mode Memory Configuration	31
3.1.3.4.2.1 Single Branch Mode Sparing	32
3.1.3.4.2.2 Dual Branch Mode Sparing	32
3.1.4 Snoop Filter	33
3.2 Enterprise South Bridge (ESB2-E)	33
3.2.1 PCI Subsystem	33
3.2.1.1 PCI32: 32-bit, 33-MHz PCI Subsystem	34
3.2.1.2 PXA: 64-bit, 133-MHz PCI Subsystem	34
3.2.1.3 PE0: One x4 PCI Express* Bus Segment	34
3.2.1.4 PE1: One x4 PCI Express* Bus Segment	34
3.2.1.5 PE2: One x4 PCI Express* Bus Segment	35
3.2.1.6 PE4, PE5, PE6, PE7: Four x4 PCI Express* Bus Segments	35
3.2.1.7 PCI Express* Riser Slot	35
3.2.2 Serial ATA Support	35
3.2.2.1 Intel® Embedded Server RAID Technology II Support	35
3.2.2.2 Intel® Embedded Server RAID Technology Option ROM	36
3.2.3 Parallel ATA (PATA) Support	36
3.2.4 USB 2.0 Support	36
3.3 Audio Codec	37
3.4 SAS Controller	38
3.4.1 SAS RAID Support	38
3.4.2 SAS/SATA Connector Sharing	38
3.5 Network Interface Controller (NIC)	38
3.5.1 Intel® I/O Acceleration Technolgy (Intel® I/OAT)	39
3.5.2 MAC Address Definition	39
3.6 Super I/O	40
3.6.1 Serial Ports	40
3.6.2 Floppy Disk Controller	40
3.6.3 Keyboard and Mouse Support	40
3.6.4 Wake-up Control	40
3.6.5 System Health Support	41
3.6.6 Trusted Platform Module (TPM)	41
4. Platform Management	42
5. Connector/Header Locations and Pin-outs	44
5.1 Board Connector Information	44
5.2 Power Connectors	45
5.3 System Management Headers	46
5.3.1 LCP/AUX IPMB Header	46
5.3.2 IPMB Header	47
5.3.3 HSBP Header	47
5.3.4 SGPIO Header	47
5.3.5 SES I2C	47
5.3.6 HDD Activity LED Header	47
5.4 Front Panel Connector	48
5.5 I/O Connectors	48
5.5.1 NIC Connectors	48
5.5.2 IDE Connector	49
5.5.3 SATA/SAS Connectors	50
5.5.4 Serial Port Connectors	50
5.5.5 Keyboard and Mouse Connector	51
5.5.6 USB Connector	51
5.5.7 CD-IN Header	52
5.5.8 Audio Connectors	52
5.6 Fan Headers	53
6. Jumper Blocks	55
6.1 CMOS Clear and Password Reset Usage Procedure	56
6.2 BMC Force Update Procedure	56
6.3 BIOS Select Jumper	57
7. Intel® Light Guided Diagnostics	58
7.1 5 Volt Standby LED	58
7.2 Fan Fault LEDs	59
7.3 System ID LED and System Status LED	60
7.3.1 System Status LED – BMC Initialization	62
7.4 DIMM Fault LEDs	62
7.5 Processor Fault LEDs	63
7.6 Post Code Diagnostic LEDs	63
8. Design and Environmental Specifications	65
8.1 Intel® Workstation Board S5000XVN Design Specifications	65
8.2 Board-level MTBF	66
8.3 Workstation Board Power Requirements	66
8.3.1 Processor Power Support	68
8.4.1 Grounding	69
8.4.2 Standby Outputs	69
8.4.3 Remote Sense	69
8.4.4 Voltage Regulation	69
8.4.5 Dynamic Loading	70
8.4.6 Capacitive Loading	70
8.4.7 Ripple/Noise	71
8.4.8 Timing Requirements	72
8.4.9 Residual Voltage Immunity in Standby Mode	74
9. Regulatory and Certification Information	75
9.1 Product Regulatory Compliance	75
9.1.1 Product Safety Compliance	75
9.1.2 Product EMC Compliance – Class A Compliance	75
9.1.3 Certifications/Registrations/Declarations	76
9.2 Product Regulatory Compliance Markings	76
9.3 Electromagnetic Compatibility Notices	77
9.3.1 FCC Verification Statement (USA)	77
9.3.2 ICES-003 (Canada)	77
9.3.3 Europe (CE Declaration of Conformity)	78
9.3.4 VCCI (Japan)	78
9.3.5 BSMI (Taiwan)	78
9.3.6 RRL (Korea)	78
9.4 Restriction of Hazardous Substances (RoHS) Compliance	79
Appendix A: Integration and Usage Tips	80
Appendix B: BMC Sensor Tables	81
Appendix C: POST Code Diagnostic LED Decoder	96
Appendix D: POST Code Errors	99
Appendix E: Supported Intel® Server Chassis	103
Glossary	104

Match case Limit results 1 per page

Intel® Workstation Board S5000XVN TPS

Design and Environmental Specifications

Revision 1.5

Intel order number: D66403-006

8.3.1

Processor Power Support

The workstation board supports the Thermal Design Point (TDP) guideline for Intel

Xeon

processors. The Flexible Motherboard Guidelines (FMB) also were followed to help determine

the suggested thermal and current design values for anticipating future processor needs. The

following table provides maximum values for Icc, TDP power, and T

CASE

for the Intel

Xeon

processor 5000 sequence family:

Table 37. Intel

Xeon

Processor Dual Processor TDP Guidelines

TDP Power

Max TCASE

Icc MAX

130 W

70º C

150 A

Note:

These values are for reference only. The Intel

Xeon

) processor 5000 sequence

Datasheet contains the actual specifications for the processor. If the values found in the Intel(r)

Xeon

processor 5000 sequence Datasheet are different than those published here, the Dual-

Core Intel

Xeon

processor 5000 sequence Datasheet values will supersede these, and should

be used.

8.4

Power Supply Output Requirements

This section is for reference purposes only. The intent is to provide guidance to system

designers to determine a power supply for use with this server board. This section specifies the

power supply requirements Intel used to develop a power supply for its workstation system.

The combined power of all outputs shall not exceed the rated output power of the power supply.

The power supply must meet both static and dynamic voltage regulation requirements for the

minimum loading conditions.

Table 38. 550 W Load Ratings

Voltage

Minimum Continuous

Maximum Continuous

Peak

+3.3 V

1.5 A

24 A

+5 V

1.0 A

24 A

+12 V1

0.5 A

16 A

18 A

+12 V2

0.5 A

16 A

18 A

+12 V3

0.5 A

14 A

+12 V4

0.5 A

8 A

13 A

-12 V

0 A

0.5 A

+5 VSB

0.1 A

3.0 A

3.5 A

Note:

Maximum continuous total DC output power should not exceed 550 W.

Maximum continuous combined load on +3.3 VDC and +5 VDC outputs shall not exceed 140

Maximum peak total DC output power should not exceed 660 W.

Peak power and current loading shall be supported for a minimum of 12 seconds.

Maximum combined current for the 12 V outputs shall be 41 A.

Peak current for the combined 12 V outputs shall be 50 A.