Intel TIGPT1U Product Specification - Page 11
Introduction
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UPC - 735858166249
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Intel® Carrier Grade Server TIGPT1U TPS Introduction 1. Introduction This document provides an overview of the Intel® Carrier Grade Server TIGPT1U (Telecom Industrial Grade Prescott 1U (1.75") high) and includes information on chassis hardware, cables, connectors, SE7210TP1-E System Baseboard, system boards, power subsystem, and regulatory requirements. 1.1 Document Structure and Outline This document is organized into the following chapters: Chapter 1: Introduction Provides an overview of this document. Chapter 2: System Overview Provides an overview of the Intel® TIGPT1U server chassis hardware. Chapter 3: Cables and Connectors Describes the cables and connectors used to interconnect the system board set and the Intel® TIGPT1U components. Chapter 4: Extended Front Panel System Board Describes the specifications of the extended front panel system board. Chapter 5: Power Interconnect System Board Describes the specifications of the power interconnect system board. Chapter 6: NEBS 3.3 V Riser Board Describes the specifications of the Network Equipment Building Specifications (NEBS) 3.3 V riser board. Chapter 7: Midplane Board Describes the specifications of the midplane board. Chapter 8: DC Power Subsystem Describes the specifications of the DC power subsystem. Chapter 9: AC Power Subsystem Describes the specifications of the AC power subsystem. Chapter 10: Regulatory Specifications Describes system compliance to regulatory specifications. Revision 1.0 Intel Secret 1
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