Lenovo ThinkPad W541 (English) Hardware Maintenance Manual - ThinkPad T540p, W - Page 98

composite., corrugatedconductivematerial., Microprocessor, GraphicProcessingUnitGPU,

Page 98 highlights

Note: Dropping a system board from a height of as little as 6 inches so that it falls flat on a hard bench can subject the accelerometer to as much as 6000 G's of shock. • Be careful not to drop the system board on a bench top that has a hard surface, such as metal, wood, or composite. • Avoid rough handling of any kind. • At every point in the process, be sure not to drop or stack the system board. • If you put a system board down, be sure to put it only on a padded surface such as an ESD mat or a corrugated conductive material. For access, remove these FRUs in order: • "1010 Battery pack" on page 58 • "1030 Large bottom door" on page 60 • "1110 Keyboard" on page 68 • "1120 Keyboard bezel assembly" on page 73 • "1150 LCD unit" on page 82 • "1160 Magnesium structure frame" on page 85 • "1170 Speaker assembly" on page 86 • "1190 Thermal fan assembly" on page 88 • "1200 USB card" on page 90 The following components soldered on the top side of the system board is extremely sensitive. When you service the system board, avoid any kind of rough handling. a Microprocessor b Graphic Processing Unit (GPU) c Accelerometer chip for the hard disk drive Active Protection System® (APS) d Platform Controller Hub (PCH) Note: GPU is only for models that have a discrete graphics card. a b c 92 Hardware Maintenance Manual

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Note:
Droppingasystemboardfromaheightofaslittleas6inchessothatitfallsflatonahardbench
cansubjecttheaccelerometertoasmuchas6000G'sofshock.
•Becarefulnottodropthesystemboardonabenchtopthathasahardsurface,suchasmetal,wood,or
composite.
• Avoid rough handling of any kind.
•Ateverypointintheprocess,besurenottodroporstackthesystemboard.
•Ifyouputasystemboarddown,besuretoputitonlyonapaddedsurfacesuchasanESDmatora
corrugatedconductivematerial.
Foraccess,removetheseFRUsinorder:
• “1010 Battery pack” on page 58
• “1030 Large bottom door” on page 60
• “1110 Keyboard” on page 68
• “1120 Keyboard bezel assembly” on page 73
• “1150 LCD unit” on page 82
• “1160 Magnesium structure frame” on page 85
• “1170 Speaker assembly” on page 86
• “1190 Thermal fan assembly” on page 88
• “1200 USB card” on page 90
Thefollowingcomponentssolderedonthetopsideofthesystemboardisextremelysensitive.Whenyou
servicethesystemboard,avoidanykindofroughhandling.
a
Microprocessor
b
GraphicProcessingUnit(GPU)
c
AccelerometerchipfortheharddiskdriveActiveProtectionSystem
®
(APS)
d
PlatformControllerHub(PCH)
Note:
GPUisonlyformodelsthathaveadiscretegraphicscard.
a
b
c
92
HardwareMaintenanceManual