HP 655 HP 655 Notebook PC - Maintenance and Service Guide - Page 73

that secure the fan/heat sink assembly to the system board.

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d. Top cover (see Top cover on page 49) e. System board (see System board on page 62) Remove the fan/heat sink assembly: 1. Turn the system board upside down, with the front toward you. 2. Disconnect the fan cable (1) from the system board. 3. Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips screws (2) that secure the fan/heat sink assembly to the system board. 4. Remove the fan/heat sink assembly (3). NOTE: Due to the adhesive quality of the thermal material located between the processor heat sink and processor, it may be necessary to move the processor heat sink from side to side to detach it. The thermal material must be thoroughly cleaned from the surfaces of the processor heat sink and the processor each time the processor heat sink is removed. Replacement thermal material is included with the processor heat sink and system board spare part kits. NOTE: The following illustration shows the replacement thermal material locations. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Component replacement procedures 65

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d.
Top cover (see
Top cover
on page
49
)
e.
System board (see
System board
on page
62
)
Remove the fan/heat sink assembly:
1.
Turn the system board upside down, with the front toward you.
2.
Disconnect the fan cable
(1)
from the system board.
3.
Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips
screws
(2)
that secure the fan/heat sink assembly to the system board.
4.
Remove the fan/heat sink assembly
(3)
.
NOTE:
Due to the adhesive quality of the thermal material located between the processor heat
sink and processor, it may be necessary to move the processor heat sink from side to side to
detach it.
The thermal material must be thoroughly cleaned from the surfaces of the processor heat sink and
the processor each time the processor heat sink is removed. Replacement thermal material is included
with the processor heat sink and system board spare part kits.
NOTE:
The following illustration shows the replacement thermal material locations. Thermal paste is
used on the processor
(1)
and the heat sink section
(2)
that services it.
Component replacement procedures
65