HP ProLiant BL495c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 20

Figure 12. HP BladeSystem c7000 interconnect bay crosslinks as indicated by the arrows HP Thermal Logic technologies The HP BladeSystem c7000 Enclosure incorporates a variety of HP Thermal Logic technologies, including mechanical design, built-in power and thermal monitoring, and control capabilities. Thermal Logic technologies can provide significant power and cooling savings compared to traditional rack and tower based servers.3 Thermal Logic technologies also provide an instant view of power use and temperature at the server, enclosure, or rack level. They automatically adjust power and thermal controls to minimize power and cooling use while maintaining adequate cooling for all devices and ensuring high availability. HP Thermal Logic technologies include the following elements and capabilities: Active Cool 200 fans Parallel Redundant Scalable Enclosure Cooling (PARSEC) design Instant power and thermal monitoring Pooled power for a variety of power redundancy modes Dynamic Power Saver mode Power Regulator Dynamic Power Capping Active Cool 200 fans Quite often, dense, full-featured, small form-factor servers use very small fans designed to provide localized cooling in the specific areas needed by the server blade. Because such fans generate fairly low airflow (in cubic feet per minute, or CFM) at medium back pressure, a single server often requires multiple fans to ensure adequate cooling. If each server blade contains several fans, installing many server blades together in an enclosure can result in a significant cost and space overhead. A second solution for cooling is to use larger, blower-style fans that can provide cooling across an entire enclosure. Such fans generate high airflow, but they typically require higher power input and more space. They are loud and must be designed for the maximum load in an enclosure. As a result, designers may have to sacrifice server features to allow large, high-power fans to fit in the enclosure. Even then, ensuring adequate airflow to all the servers without leakage, over provisioning, or bypass is a challenge. 3 For more information see the IDC technical brief titled ―Next-Generation Power and Cooling for Blade Environments‖: http://h20195.www2.hp.com/v2/GetPDF.aspx/4AA2-5177ENW.pdf. 20