HP ProLiant BL495c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 22

device is in the path of hot exhaust air from another device, and that air goes only where it is

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docking collar, and the server shut-off door opens to allow airflow across that server blade. Similarly, the fan seals into the center air plenum docking collar. Each fan bay includes louvers that automatically open when a fan is installed. If a fan is not installed or is not functional, the pressure distribution around the fan changes. This pressure change causes the louvers to close, ensuring that cooling air is not diverted through the inoperative fan (Figure 14). Figure 14. HP BladeSystem c7000 self-sealing enclosure The enclosure and the components within it optimize the cooling capacity through unique mechanical designs. Managed airflow through the enclosure ensures that every device gets cool air, that no device is in the path of hot exhaust air from another device, and that air goes only where it is needed for cooling. Fresh air is pulled into the interconnect bays through a slot in the front of the enclosure. Ducts allow the air to move from the front to the rear of the enclosure, where it is then pulled into the interconnects and the central plenum. The air is then exhausted out the rear of the system (Figure 15). 22

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docking collar, and the server shut-off door opens to allow airflow across that server blade. Similarly,
the fan seals into the center air plenum docking collar. Each fan bay includes louvers that
automatically open when a fan is installed. If a fan is not installed or is not functional, the pressure
distribution around the fan changes. This pressure change causes the louvers to close, ensuring that
cooling air is not diverted through the inoperative fan (Figure 14).
Figure 14.
HP BladeSystem c7000 self-sealing enclosure
The enclosure and the components within it optimize the cooling capacity through unique mechanical
designs. Managed airflow through the enclosure ensures that every device gets cool air, that no
device is in the path of hot exhaust air from another device, and that air goes only where it is needed
for cooling. Fresh air is pulled into the interconnect bays through a slot in the front of the enclosure.
Ducts allow the air to move from the front to the rear of the enclosure, where it is then pulled into the
interconnects and the central plenum. The air is then exhausted out the rear of the system (Figure 15).