HP ProLiant BL495c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 4

The c7000 Enclosure has redundant signal paths between servers and interconnect modules

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Figure 1. HP BladeSystem c7000 Enclosure - front view Figure 2. HP BladeSystem c7000 Enclosure - rear view The c7000 enclosure is10U high and includes a shared, 5-terabit-per-second, high-speed NonStop midplane for wire-once connection of server blades to network and shared storage. A pooled-power backplane delivers power and ensures that the full capacity of the power supplies is available to all server blades and interconnects. The enclosure is available with either a single-phase AC, three-phase AC, or -48V DC power subsystem to meet the needs of the data center power infrastructure. The c7000 Enclosure has redundant signal paths between servers and interconnect modules (Figure 3). The NonStop signal midplane and separate power backplane in the c7000 enclosure have no active components. Separating the power delivery in the backplane from the high-speed interconnect signals in the midplane results in minimal thermal stress to the signal midplane. 4

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Figure 1
.
HP BladeSystem c7000 Enclosure
–
front view
Figure 2.
HP BladeSystem c7000 Enclosure
–
rear view
The c7000 enclosure is10U high and includes a shared, 5-terabit-per-second, high-speed NonStop
midplane for wire-once connection of server blades to network and shared storage. A pooled-power
backplane delivers power and ensures that the full capacity of the power supplies is available to all
server blades and interconnects. The enclosure is available with either a single-phase AC, three-phase
AC, or -48V DC power subsystem to meet the needs of the data center power infrastructure.
The c7000 Enclosure has redundant signal paths between servers and interconnect modules
(Figure 3). The NonStop signal midplane and separate power backplane in the c7000 enclosure
have no active components. Separating the power delivery in the backplane from the high-speed
interconnect signals in the midplane results in minimal thermal stress to the signal midplane.