HP dv6-1245dx HP Pavilion dv6 Entertainment PC - Maintenance and Service Guide - Page 114

CAUTION, the Northbridge chip

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CAUTION: Remove the screws in the order indicated by the callouts to ensure consistent pressure over the processor board. 4. Loosen the three Phillips PM2.5×5.0 captive screws (5), (6), and (7) that secure the fan/heat sink assembly to the system board. CAUTION: Remove the screws in the order indicated by the callouts to ensure consistent pressure over the processor board. 5. Remove the fan/heat sink assembly (8). NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is applied to the fan/heat sink assembly to correspond with components on the system board as follows: the processor (1) and (2), the Northbridge chip (3) and (4), the graphics subsystem chip (5) and (6), and three capacitors (7) and (8). Replacement thermal material is included with all fan/ heat sink assembly, system board, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. 106 Chapter 4 Removal and replacement procedures

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CAUTION:
Remove the screws in the order indicated by the callouts to ensure consistent
pressure over the processor board.
4.
Loosen the three Phillips PM2.5×5.0 captive screws
(5)
,
(6)
, and
(7)
that secure the fan/heat sink
assembly to the system board.
CAUTION:
Remove the screws in the order indicated by the callouts to ensure consistent
pressure over the processor board.
5.
Remove the fan/heat sink assembly
(8)
.
NOTE:
Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach the assembly.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste
is applied to the fan/heat sink assembly to correspond with components on the system board as
follows: the processor
(1)
and
(2)
, the Northbridge chip
(3)
and
(4)
, the graphics subsystem chip
(5)
and
(6)
, and three capacitors
(7)
and
(8)
. Replacement thermal material is included with all fan/
heat sink assembly, system board, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
106
Chapter 4
Removal and replacement procedures