IBM 8863 User Manual - Page 17

Major, components, xSeries, server

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Major components of the xSeries 366 Type 8863 server Blue on a component indicates touch points, where you can grip the component to remove it from or install it in the server, open or close a latch, and so on. Orange on a component or an orange label on or near a component indicates that the component can be hot-swapped, which means that if the server and operating system support hot-swap capability, you can remove or install the component while the server is running. (Orange can also indicate touch points on hot-swap components.) See the instructions for removing or installing a specific hot-swap component for any additional procedures that you might have to perform before you remove or install the component. The following illustration shows the major components in the server. Top cover DIMM Hard disk drive filler panel Memory card Hot-swap fans 92 mm Hot-swap fans 80 mm Hot-swap hard disk drive Air baffle Microprocessor baffle Heat sink FRONT Microprocessor PCI-X divider I/O board Hot-swap power supply PCI-X slots CD-ROM drive Operator information panel VRM Microprocessor tray xSerier 365 Bezel Chapter 1. Introduction 5

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Major
components
of
the
xSeries
366
Type
8863
server
Blue
on
a
component
indicates
touch
points,
where
you
can
grip
the
component
to
remove
it
from
or
install
it
in
the
server,
open
or
close
a
latch,
and
so
on.
Orange
on
a
component
or
an
orange
label
on
or
near
a
component
indicates
that
the
component
can
be
hot-swapped,
which
means
that
if
the
server
and
operating
system
support
hot-swap
capability,
you
can
remove
or
install
the
component
while
the
server
is
running.
(Orange
can
also
indicate
touch
points
on
hot-swap
components.)
See
the
instructions
for
removing
or
installing
a
specific
hot-swap
component
for
any
additional
procedures
that
you
might
have
to
perform
before
you
remove
or
install
the
component.
The
following
illustration
shows
the
major
components
in
the
server.
Memory
card
Hot-swap
power
supply
I/O board
Hot-swap fans
92 mm
Hot-swap fans
80 mm
Operator information
panel
Hot-swap
hard disk
drive
Hard disk
drive filler
panel
CD-ROM drive
Bezel
Heat sink
Microprocessor
Microprocessor
baffle
PCI-X divider
DIMM
Microprocessor tray
VRM
Top cover
FRONT
Air baffle
PCI-X slots
Chapter
1.
Introduction
5