Seagate ST1.2 ST1.2 Series Product Manual - Page 32

26

ST1.2 Series Product Manual, Rev. B

Note.

RFU is Reserved for Future Use

[1]

These signals are required only for 16 bit accesses and not required when installed in 8 bit systems.

Devices should allow for 3-state signals not to consume current.

[2]

The signal should be grounded by the host.

[3]

The signal should be tied to VCC by the host.

[4]

The mode is optional for CF+ Cards, but required for CompactFlash Storage Cards.

[5]

The -CSEL signal is ignored by the card in PC Card modes. However, because it is not pulled up on the

card in these modes, it should not be left floating by the host in PC Card modes. In these modes, the pin

should be connected by the host to PC Card A25 or grounded by the host.

[6]

If DMA operations are not used, the signal should be held high or tied to VCC by the host. For proper

operation in older hosts: while DMA operations are not active, the card shall ignore this signal, including a

floating condition.

24

WP

O

OT3

24

-IOIS16

O

OT3

24

-IOIS16

O

ON3

25

-CD2

O

Ground

25

-CD2

O

Ground

25

-CD2

O

Ground

26

-CD1

O

Ground

26

-CD1

O

Ground

26

-CD1

O

Ground

27

D11

[1]

I/O

I1Z, OZ3

27

D11

[1]

I/O

I1Z, OZ3

27

D11

[1]

I/O

I1Z, OZ3

28

D12

[1]

I/O

I1Z, OZ3

28

D12

[1]

I/O

I1Z, OZ3

28

D12

[1]

I/O

I1Z, OZ3

29

D13

[1]

I/O

I1Z, OZ3

29

D13

[1]

I/O

I1Z, OZ3

29

D13

[1]

I/O

I1Z, OZ3

30

D14

[1]

I/O

I1Z, OZ3

30

D14

[1]

I/O

I1Z, OZ3

30

D14

[1]

I/O

I1Z, OZ3

31

D15

[1]

I/O

I1Z, OZ3

31

D15

[1]

I/O

I1Z, OZ3

31

D15

[1]

I/O

I1Z, OZ3

32

-CE2

[1]

I

I3U

32

-CE2

[1]

I

I3U

32

-CS1

[1]

I

I3Z

33

-VS1

O

Ground

33

-VS1

O

Ground

33

-VS1

O

Ground

34

-IORD

I

I3U

34

-IORD

I

I3U

34

-IORD

I

I3Z

35

-IORW

I

I3U

35

-IORW

I

I3U

35

-IORW

I

I3Z

36

-WE

I

I3U

36

-WE

I

I3U

36

-WE

[3]

I

I3U

37

READY

O

OT1

37

-IREQ

O

OT1

37

INTRQ

O

OZ1

38

VCC

Power

38

VCC

Power

38

VCC

Power

39

-CSEL

[5]

I

I2Z

39

-CSEL

[5]

I

I2Z

39

-CSEL

I

I2U

40

-VS2

O

OPEN

40

-VS2

O

OPEN

40

-VS2

O

OPEN

41

RESET

I

I2Z

41

RESET

I

I2Z

41

-RESET

I

I2Z

42

-WAIT

O

OT1

42

-WAIT

O

OT1

42

IORDY

O

ON1

43

-INPACK

O

OT1

43

-INPACK

O

OT1

43

DMARC

O

OZ1

44

-REG

I

I3U

44

-REG

I

I3U

44

-DMACK

[6]

I

I3U

45

BVD2

O

OT1

45

-SPKR

O

OT1

45

-DASP

I/O

I1U, ON1

46

BVD1

O

OT1

46

-STSCHG

O

OT1

46

-PDIAG

I/O

I1U, ON1

47

D08

[1]

I/O

I1Z, OZ3

47

D08

[1]

I/O

I1Z, OZ3

47

D08

[1]

I/O

I1Z, OZ3

48

D09

[1]

I/O

I1Z, OZ3

48

D09

[1]

I/O

I1Z, OZ3

48

D09

[1]

I/O

I1Z, OZ3

49

D10

[1]

I/O

I1Z, OZ3

49

D10

[1]

I/O

I1Z, OZ3

49

D10

[1]

I/O

I1Z, OZ3

50

GND

Ground

50

GND

Ground

50

GND

Ground

Table 8:

CompactFlash+ interface connector signals

PC Card Memory Mode

PC Card I/O Mode

True IDE Mode

[4]

Section	Page
1.0 Introduction 1	3
1.1 Disclaimer 2	3
1.2 Drive care 2	3
1.3 Handling precautions 2	3
2.0 Drive specifications 3	3
2.1 Power, access times and acoustics 3	3
2.2 Formatted capacity 5	3
2.3 Default logical geometry 5	3
2.4 Recording and interface technology 6	3
2.5 Physical characteristics 6	3
2.6 Time to ready 6	3
2.7 Power specifications 7	3
2.7.1 Power consumption 7	3
2.7.2 Conducted noise 9	3
2.7.3 Voltage tolerance 9	3
2.7.4 Power-management modes 10	3
2.8 Environmental specifications 11	3
2.8.1 Ambient temperature 11	3
2.8.2 Temperature gradient 11	3
2.8.3 Humidity 11	3
2.8.4 Altitude 11	3
2.8.5 Shock 12	3
2.8.6 Vibration 12	3
2.9 Acoustics 15	3
2.10 Electromagnetic immunity 15	3
2.11 Reliability 16	3
2.12 Agency certification 17	3
2.12.1 Safety certification 17	3
2.12.2 Electromagnetic compatibility 17	3
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive 17	3
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive 18	3
2.12.5 FCC verification 18	3
3.0 Configuring and mounting the drive 21	3
3.1 Handling and static discharge precautions 21	3
3.2 Drive installation 22	3
4.0 Interface description 25	3
4.1 Connector interface signals and connector pins 25	3
4.1.1 Flex interface connector signals 27	3
4.1.2 Supported ATA commands 29	3
4.1.3 Identify Device command 31	3
4.1.4 Set Features command 35	3
4.1.5 Card Information Structure (CIS) information for CF 37	3
5.0 Seagate Technology support services 49	3
Figure 1. ST1.2 Series CompactFlash+ disc drive 1	5
Figure 2. ST1.2 Series Flex (IDE interface) disc drive 1	5
Figure 3. ST1.2 Series breather hole location 2	5
Figure 4. ST1.2 Series improper handling example 2	5
Figure 5. Typical 3.3V startup and operation current profile 8	5
Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive 12	5
Figure 7. Drive axis definition for ST1.2 drives 12	5
Figure 8. ST1.2 Series proper handling example 21	5
Figure 9. ST1.2 Series improper handling example 21	5
Figure 10. CF model mechanical dimensions-top, side and end view 22	5
Figure 11. FX model mechanical dimensions-top, side and end view 23	5
1.0 Introduction	7
1.1 Disclaimer	8
1.2 Drive care	8
1.3 Handling precautions	8
2.0 Drive specifications	9
2.1 Power, access times and acoustics	9
2.2 Formatted capacity	11
2.3 Default logical geometry	11
2.4 Recording and interface technology	12
2.5 Physical characteristics	12
2.6 Time to ready	12
2.7 Power specifications	13
2.7.1 Power consumption	13
2.7.1.1 Typical current profile	14
2.7.2 Conducted noise	15
2.7.3 Voltage tolerance	15
2.7.4 Power-management modes	16
2.8 Environmental specifications	17
2.8.1 Ambient temperature	17
2.8.2 Temperature gradient	17
2.8.3 Humidity	17
2.8.3.1 Relative humidity	17
2.8.3.2 Wet bulb temperature	17
2.8.4 Altitude	17
2.8.5 Shock	18
2.8.5.1 Operating shock	18
2.8.5.2 Nonoperating shock	18
2.8.6 Vibration	18
2.8.6.1 Operating sweep sine vibration	19
2.8.6.2 Operating random vibration	19
2.8.6.3 Nonoperating sweep sine vibration	19
2.8.6.4 Nonoperating random vibration	20
2.8.6.5 Corrosive environment	20
2.9 Acoustics	21
2.10 Electromagnetic immunity	21
2.11 Reliability	22
2.12 Agency certification	23
2.12.1 Safety certification	23
2.12.2 Electromagnetic compatibility	23
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive	23
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive	24
2.12.5 FCC verification	24
3.0 Configuring and mounting the drive	27
3.1 Handling and static discharge precautions	27
3.2 Drive installation	28
4.0 Interface description	31
4.1 Connector interface signals and connector pins	31
4.1.1 Flex interface connector signals	33
4.1.2 Supported ATA commands	35
4.1.3 Identify Device command	37
4.1.4 Set Features command	41
4.1.5 Card Information Structure (CIS) information for CF	43
5.0 Seagate Technology support services	55
Index	61
A	61
B	61
C	61
D	61
E	61
F	61
G	61
H	61
I	61
K	61
L	61
M	62
N	62
O	62
P	62
R	62
S	62
T	62
V	62

Seagate ST1.2 ST1.2 Series Product Manual - Page 32

Table 8, CompactFlash+ interface connector signals

Page 32 highlights